MC9S08AW48CPUE vs MC9S08AW60MPUE557 Comparação

Comparação detalhada lado a lado de MC9S08AW48CPUE por NXP Semiconductors e MC9S08AW60MPUE557 por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd
NXP Semiconductors
MC9S08AW60MPUE557 MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64

MC9S08AW60MPUE557 ✓ Ativo

Comparação de especificações

Parâmetro MC9S08AW48CPUE MC9S08AW60MPUE557
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $6,10
Core Processor S08 (HCS08) 8-bit CISC —
Core Size 8-bit —
CPU Speed 40 MHz —
Internal Bus Frequency 20 MHz 20 MHz
Program Memory Type FLASH —
Program Memory Size 48 KB (48K x 8) —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Supply Voltage Range 2.7 V to 5.5 V —
I/O Count 38 —
Package Type 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) —
Package Height 1 mm —
Tipo de montagem Surface Mount Surface Mount
Temperatura de operação [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Debug Interface Single-wire background debug mode (BDM) Single-wire Background Debug Mode (BDM)
Instruction Set HC08 with added BGND instruction —
Packaging Tray —
Status do ciclo de vida NRND (Not Recommended for New Designs) —
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Core Architecture — HCS08 (enhanced S08)
Largura do barramento de dados — 8-bit
CPU Clock Speed — 40 MHz
Program Memory (Flash) — 60 KB (60K x 8)
RAM — 4 KB
Tensão de alimentação de operação — 2.7 V to 5.5 V
I/O Pins — 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa
Encapsulamento — 64-LQFP (10x10 mm)
ADC — [DATA_NEEDED: number of channels and resolution]
PWM Channels — [DATA_NEEDED: PWM channel count]
Serial Interfaces — SCI, SPI, I2C (per NXP family description)
Lead-Free — [DATA_NEEDED: lead-free status]

Fichas técnicas e recursos

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