MC9S08AW60CFGE vs S9S08AW60E5MFGER 对比
详细并排对比 MC9S08AW60CFGE 出自 NXP Semiconductors 和 S9S08AW60E5MFGER 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08AW60CFGE | S9S08AW60E5MFGER |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $6.05 |
| Core Processor | S08 (HCS08) 8-bit CISC | — |
| Core Size | 8-Bit | — |
| Maximum CPU Frequency | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Flash Memory | 60 KB (60K x 8) | — |
| RAM Size | [DATA_NEEDED: RAM size] (Mouser listing states 4K; FindIC overview states 2K) | — |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| I/O Count | 38 general-purpose I/O | — |
| ADC Resolution | 10-bit, 8-channel | — |
| Instruction Set | HC08 instruction set with added BGND instruction | — |
| Debug Interface | Single-wire background debug mode (BDM) | BDM (Background Debug Mode) |
| 封装 | 44-LQFP (10x10 mm), 0.50 mm pitch, MO-220VKKD-2 | 44-pin LQFP (10 x 10 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| Supply Voltage Nominal | 3.3 V / 5 V | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40C to +125C (automotive range) |
| Packaging | Tray | — |
| 生命周期状态 | NRND (Not Recommended for New Designs) per NXP | — |
| Family | MC9S08AW (S08AW series) | S08 / MC9S08AW60 series |
| Core Architecture | — | HCS08 (S08 enhanced), 8-bit CISC |
| CPU Clock (Max) | — | 40 MHz (20 MHz bus) |
| Program Flash | — | 60 KB (60K x 8) |
| RAM | — | [DATA_NEEDED: RAM size] |
| EEPROM / Data Flash | — | [DATA_NEEDED: data EEPROM size] |
| 电源电压 | — | 3 V / 3.3 V / 5 V |
| I/O Pins | — | [DATA_NEEDED: GPIO count] |
| ADC | — | Multi-channel 10-bit (per family) |
| Communication | — | SCI (UART), SPI, I2C |
| Timers | — | TPM modules with PWM channels |
| Automotive/Industrial | — | Dual-targeted |
| Lead Free / RoHS | — | Yes (per suffix "E" = Pb-free, "R" = tape & reel) |