MC9S08DV60AMLH vs MC9S08DN60ACLH 对比
详细并排对比 MC9S08DV60AMLH 出自 NXP Semiconductors 和 MC9S08DN60ACLH 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08DV60AMLH | MC9S08DN60ACLH |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $3.85 | $5.21 |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | 2 KB (2K x 8) |
| Number of I/O | 53 | 53 |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | External |
| Interrupt/Reset Sources | Up to 32 | — |
| 电源电压 | 3.3V/5V | — |
| 封装 / 外壳 | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 + BGND instruction |
| Core | — | HCS08 (S08 core) |
| 数据总线宽度 | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| 工作温度 | — | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| RoHS 状态 | — | Compliant |
| On-Chip Debug | — | BDM (Background Debug Mode) |