MC9S08DV60AMLH vs MC9S08DN60ACLH Vergleich
Detaillierter Direktvergleich von MC9S08DV60AMLH von NXP Semiconductors und MC9S08DN60ACLH von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DV60AMLH | MC9S08DN60ACLH |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,85 | $5,21 |
| Core Processor | S08 (HCS08), 8-bit | — |
| Core Size | 8-Bit | — |
| Speed | 40MHz CPU (20MHz bus) | — |
| Program Memory Size | 60KB (60K x 8) | — |
| Program Memory Type | FLASH | — |
| RAM Size | 3K x 8 | 2 KB (2K x 8) |
| Number of I/O | 53 | 53 |
| Input-Only Pins | 1 | — |
| ADC Resolution | 12-bit | — |
| ADC Channels | 16 | — |
| ADC Conversion Time | 2.5 us | — |
| Connectivity | CAN (MSCAN), LIN master | — |
| Oscillator Type | External | External |
| Interrupt/Reset Sources | Up to 32 | — |
| Versorgungsspannung | 3.3V/5V | — |
| Gehäuse / Bauform | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Instruction Set | HC08 with added BGND instruction | HC08 + BGND instruction |
| Core | — | HCS08 (S08 core) |
| Datenbusbreite | — | 8 bit |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| EEPROM | — | Embedded (size [DATA_NEEDED: EEPROM size]) |
| ADC | — | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | — | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Interrupt Sources | — | Up to 32 |
| Betriebstemperatur | — | -40C to +85C [DATA_NEEDED: confirm automotive grade range] |
| RoHS-Status | — | Compliant |
| On-Chip Debug | — | BDM (Background Debug Mode) |