MC9S08DZ60ACLF vs MC9S08DZ60ACLH 对比

详细并排对比 MC9S08DZ60ACLF 出自 NXP Semiconductors 和 MC9S08DZ60ACLH 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S08DZ60ACLH MC9S08DZ60ACLH - S08 8-bit MCU 60KB Flash CAN LQFP-64 | NXP

MC9S08DZ60ACLH - S08 8-bit MCU 60KB Flash CAN LQFP-64 | NXP

MC9S08DZ60ACLH Nrnd

规格对比

参数 MC9S08DZ60ACLF MC9S08DZ60ACLH
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $6.85 $5.10
Core HCS08 (8-bit CISC) HCS08 (8-bit CISC)
Core Frequency 40 MHz (20 MHz bus) —
Program Memory (Flash) 60 KB (60K x 8) —
RAM 4 KB —
EEPROM / Emulated EEPROM Available (size [DATA_NEEDED: EEPROM size]) —
Operating Voltage 2.7 V to 5.5 V —
Supply Rails 3.3 V / 5 V —
ADC 24-channel, 12-bit, 2.5 us conversion 24-channel, 12-bit, 2.5 us conversion
CAN 1 x CAN 2.0 A/B 1 x CAN 2.0A/B
LIN Master LIN 2.0 interface —
Communication Peripherals SCI (SPI), IIC, MSCAN —
Timer / PWM Channels Multiple (count [DATA_NEEDED: timer/PWM channel count]) —
LCD Driver Yes (on-chip segment LCD driver) —
封装 48-LQFP (7x7 mm) 64-LQFP (10x10 mm)
工作温度 -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] -40 C to +85 C (industrial)
安装类型 Surface Mount Surface Mount
MSL 等级 MSL 3 (per JEDEC J-STD-020) —
RoHS 状态 Compliant Compliant
Background Debug Mode (BGND) Yes (on-chip emulation/debug) —
Instruction Set HC08 instruction set with added BGND instruction —
CPU Frequency — 40 MHz CPU / 20 MHz bus
Flash Size — 60 KB (60K x 8)
RAM Size — 2 KB
EEPROM Size — 4 KB
数据总线宽度 — 8 bit
引脚数量 — 64
电源电压 — 2.7 V to 5.5 V (3.3 V / 5 V dual)
SCI (UART) — 2 channels
I2C — 1 channel
SPI — 1 channel
GPIO — 53 I/O pins
PWM — 6-channel timer/PWM
Debug Interface — Background Debug Mode (BDM)

数据手册与资源

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