MC9S08EL32CTJ vs S9S08EL32F1CTJ 对比
详细并排对比 MC9S08EL32CTJ 出自 NXP Semiconductors 和 S9S08EL32F1CTJ 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08EL32CTJ | S9S08EL32F1CTJ |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $4.18 | $5.25 |
| Product Type | 8-bit HCS08 microcontroller | 8-bit Microcontroller (MCU) |
| Flash Memory | 32 KB | — |
| RAM | 1 KB | — |
| Maximum CPU Frequency | 40 MHz | [DATA_NEEDED: maximum bus frequency MHz] |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| Architecture | 8-bit | — |
| Core | HCS08 core | — |
| 封装 | 20-pin TSSOP | — |
| 安装类型 | Surface mount | Surface Mount |
| Temperature Grade | Industrial | — |
| 生命周期状态 | NRND | — |
| Connectivity | Embedded Slave LIN Interface Controller | — |
| Nonvolatile Feature | EEPROM supported in the MC9S08EL32 series | — |
| Program Memory Organization | [DATA_NEEDED: Flash memory organization] | — |
| CPU Architecture | [DATA_NEEDED: instruction set details] | — |
| Clock Source | [DATA_NEEDED: internal and external clock options] | — |
| Peripheral List | [DATA_NEEDED: integrated peripheral inventory] | — |
| ADC | [DATA_NEEDED: ADC resolution and channels] | — |
| Timers | [DATA_NEEDED: timer count and operating modes] | — |
| Communication Interfaces | [DATA_NEEDED: complete communication interface list] | SPI |
| 工作温度 | [DATA_NEEDED: operating temperature range] | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS status from manufacturer page] |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: automotive qualification status] | — |
| Pinout Reference | [DATA_NEEDED: complete 20-pin pinout] | — |
| Core Family | — | HCS08 |
| Program Memory (Flash) | — | 32 KB |
| Data Memory (RAM) | — | 1 KB |
| CPU Core | — | Freescale/NXP HCS08, 8-bit |
| Package Type | — | 144-pin LFQFP (FJ-type) |
| Package Code | — | LFQFP |
| Terminal Form | — | GULL WING |
| Package Shape | — | SQUARE |
| 工作温度范围 | — | -40 C to +85 C |
| On-Chip Analog Comparator | — | Yes |
| On-Chip Debug | — | BDM (Background Debug Mode) |