MC9S08GB32CFUE vs MC9S08GB32CFU 对比
详细并排对比 MC9S08GB32CFUE 出自 NXP Semiconductors 和 MC9S08GB32CFU 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08GB32CFUE | MC9S08GB32CFU |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.41 | $4.10 |
| Core Architecture | HCS08 (S08 family) | — |
| 数据总线宽度 | 8-bit | — |
| Program Memory Size | 32 KB (32K x 8) Flash | — |
| RAM Size | 2 KB | — |
| Maximum CPU Frequency | 40 MHz | 40 MHz |
| Number of I/O Pins | 56 | — |
| 封装 / 外壳 | 64-LQFP (10x10 mm) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Supply Voltage Range | 2.7 V to 5.5 V (operational, typical 5 V) | — |
| 工作温度范围 | -40C to +85C (industrial) | — |
| On-chip ADC | Yes (resolution and channel count per datasheet) | — |
| Communication Interfaces | SCI (UART), SPI, I2C | — |
| Timers | 16-bit timer/PWM module(s) | TPM1, TPM2 (16-bit) |
| Debug Interface | Background Debug Mode (BDM) | — |
| RoHS 状态 | Compliant | Compliant (lead-free LFQFP) |
| MSL 等级 | Per JEDEC J-STD-020 (see datasheet) | 3 (per JEDEC J-STD-020) |
| Lead-Free / Halogen-Free | Lead-free per manufacturer datasheet | — |
| Core | — | HCS08 (8-bit CISC) |
| Program Memory | — | 32 KB Flash |
| RAM | — | 2 KB |
| Operating Voltage | — | 2.7 V to 5.5 V |
| ADC | — | 10-bit, 8 channels |
| USB | — | USB 2.0 Full-Speed Device |
| CAN | — | MSCAN (CAN 2.0A/B), 1 module |
| SCI/UART | — | 2 modules |
| SPI | — | 1 module |
| I2C | — | 1 module |
| GPIO Pins | — | 56 |
| 封装 | — | 64-LQFP (10x10 mm, 0.5 mm pitch) |
| 工作温度 | — | -40 C to +85 C (industrial) |