MC9S12B64CFUE vs MC9S12B64MFUE 对比

详细并排对比 MC9S12B64CFUE 出自 NXP Semiconductors 和 MC9S12B64MFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12B64CFUE MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP

MC9S12B64CFUE - 16-Bit HCS12 MCU 64KB Flash 25MHz 80-QFP | NXP

MC9S12B64CFUE ⚠ 最后一次采购
NXP Semiconductors
MC9S12B64MFUE MC9S12B64MFUE - 16-Bit 25MHz HCS12 MCU 64KB Flash | NXP

MC9S12B64MFUE - 16-Bit 25MHz HCS12 MCU 64KB Flash | NXP

MC9S12B64MFUE ✓ 量产中

规格对比

参数 MC9S12B64CFUE MC9S12B64MFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $10.10 $9.10
Core HCS12 (S12 CISC, 16-bit) HCS12 (CISC)
Flash Memory 64 KB —
RAM 2 KB —
EEPROM 1 KB —
Maximum CPU Frequency 25 MHz —
电源电压 5 V (typical) 5 V
工作温度范围 0C to +70C (commercial 'C' grade) [DATA_NEEDED: operating temperature range]
封装 80-QFP (14x14 mm) 80-QFP (14 x 14 mm)
安装类型 Surface Mount Surface Mount
ADC 8-channel, 10-bit —
CAN Module 1x MSCAN 2.0A/B —
SCI/SPI 2x SCI, 1x SPI —
Timers 16-bit Timer + 8-bit PWM + PIT [DATA_NEEDED: timer module count]
I/O Pins [DATA_NEEDED: I/O pin count] —
Debug Interface Background Debug Mode (BDM) BDM (Background Debug Mode)
RoHS 状态 Compliant RoHS non-compliant (Pb-free process, SnPb or matte tin finish per datasheet packaging code)
Lead-Free / Terminal Finish Matte Tin (Sn) —
Peak Reflow Temperature 260C (max 40 s) —
Series — HCS12
数据总线宽度 — 16-bit
最大时钟频率 — 25 MHz
Program Memory Size (Flash) — 64 KB (64K x 8)
RAM Size — 2 KB
引脚数量 — 80
Communication Interfaces — CAN, SCI (UART), SPI
A/D Channels — [DATA_NEEDED: A/D channel count]
A/D Resolution — [DATA_NEEDED: A/D resolution]
PWM Channels — [DATA_NEEDED: PWM channel count]
Lead-Free / Lead Content — [DATA_NEEDED: lead-free status]

数据手册与资源

浏览全部产品 创建 BOM 获取报价