MC9S12D64MFUE vs MC9S12D64CFUE 对比
详细并排对比 MC9S12D64MFUE 出自 NXP Semiconductors 和 MC9S12D64CFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S12D64MFUE | MC9S12D64CFUE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $8.35 | $16.20 |
| Core Architecture | HCS12 (16-bit CISC) | — |
| CPU Core | S12 CPU V2 | — |
| Operating Frequency | 25 MHz | — |
| Program Memory Type | Flash | — |
| Program Memory Size | 64 KB (64K x 8) | — |
| 封装 | 80-QFP (14 x 14 mm), also called PQFP-80 | 80-QFP (14 x 14 mm) |
| 安装类型 | Surface Mount (SMD/SMT) | Surface Mount |
| 电源电压 | 2.5 V / 5 V | 2.5 V / 5 V |
| Number of I/O | 59 | 59 |
| ADC | 2 x 10-bit, 8 channels each (16 ADC channels total) | 8-channel, 10-bit |
| PWM Channels | 8 channels | — |
| Capture/Compare Timers | 8-channel Enhanced Capture Timer (ECT) | — |
| Communication Interfaces | 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC | — |
| 工作温度范围 | -40 C to +125 C | — |
| Automotive Qualification | AEC-Q100 | — |
| RoHS 状态 | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Packaging Method (tray / reel) | Tray | — |
| Approximate Weight | 0.033 oz (per supplier catalog) | — |
| Debug Interface | BDM (Background Debug Mode) | — |
| Watchdog / COP | Yes (COP reset, watchdog timer) | — |
| Core | — | HCS12 (16-bit CISC) |
| Maximum CPU Frequency | — | 25 MHz |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| RAM | — | 4 KB |
| EEPROM | — | 1 KB |
| Communication Peripherals | — | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) |
| Timers | — | ECT, TIM, PWM, PIT |
| 工作温度 | — | [DATA_NEEDED: operating temperature range] |
| Packaging | — | Tray |