MC9S12D64MFUE vs MC9S12D64CFUE 비교

다음의 상세 나란히 비교: MC9S12D64MFUE 제조: NXP Semiconductors 및 MC9S12D64CFUE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12D64MFUE MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64MFUE Nrnd
NXP Semiconductors
MC9S12D64CFUE MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

MC9S12D64CFUE Nrnd

사양 비교

파라미터 MC9S12D64MFUE MC9S12D64CFUE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $8.35 $16.20
Core Architecture HCS12 (16-bit CISC) —
CPU Core S12 CPU V2 —
Operating Frequency 25 MHz —
Program Memory Type Flash —
Program Memory Size 64 KB (64K x 8) —
패키지 80-QFP (14 x 14 mm), also called PQFP-80 80-QFP (14 x 14 mm)
실장 유형 Surface Mount (SMD/SMT) Surface Mount
공급 전압 2.5 V / 5 V 2.5 V / 5 V
Number of I/O 59 59
ADC 2 x 10-bit, 8 channels each (16 ADC channels total) 8-channel, 10-bit
PWM Channels 8 channels —
Capture/Compare Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI, 1 x SPI, 1 x IIC, 1 x CAN 2.0, 1 x BDLC —
동작 온도 범위 -40 C to +125 C —
Automotive Qualification AEC-Q100 —
RoHS 상태 Compliant [DATA_NEEDED: RoHS compliance status]
Packaging Method (tray / reel) Tray —
Approximate Weight 0.033 oz (per supplier catalog) —
Debug Interface BDM (Background Debug Mode) —
Watchdog / COP Yes (COP reset, watchdog timer) —
Core — HCS12 (16-bit CISC)
Maximum CPU Frequency — 25 MHz
Program Memory (Flash) — 64 KB (64K x 8)
RAM — 4 KB
EEPROM — 1 KB
Communication Peripherals — 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B)
Timers — ECT, TIM, PWM, PIT
동작 온도 — [DATA_NEEDED: operating temperature range]
Packaging — Tray

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