MC9S12DG128MPVE vs MC9S12DG128CPVE 对比

详细并排对比 MC9S12DG128MPVE 出自 NXP Semiconductors 和 MC9S12DG128CPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DG128MPVE MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE Nrnd
NXP Semiconductors
MC9S12DG128CPVE MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE Nrnd

规格对比

参数 MC9S12DG128MPVE MC9S12DG128CPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $11.75 $0.00
Product Family S12DG (HCS12) —
Core Architecture HCS12 (CPU12, 16-bit CISC) —
CPU Clock Frequency 25 MHz (max) —
Bus Clock 50 MHz (max) —
Program Memory (Flash) 128 KB —
RAM 8 KB 8 KB
EEPROM 2 KB 2 KB
电源电压 2.35 V to 2.75 V (core) / 5 V I/O 2.35 V to 5.25 V
工作温度范围 -40C to +125C (automotive grade) —
Digital I/O Pins 59 —
ADC 2 x 10-bit, 8 channels each (16 total) Two 8-channel, 10-bit ADCs; 16 channels total
PWM Channels 8 channels —
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Channels 2 —
SPI Channels 1 —
CAN Module 1 (msCAN) —
封装 112-LQFP (20 x 20 mm, 0.5 mm pitch) 112-LQFP, 20 mm x 20 mm
安装类型 Surface Mount —
RoHS 状态 Compliant —
生命周期状态 NRND (Not Recommended for New Designs) —
Product Type — 16-bit HCS12 microcontroller
Core Frequency — 25 MHz
Program Memory — 128 KB flash
Architecture — HCS12, CISC
Serial Communications — Two asynchronous serial communications interfaces
Timer — 8-channel IC/OC enhanced capture timer
PWM — 8-channel pulse-width modulator
Digital I/O — 20 discrete digital I/O lines
工作温度 — -40°C to +85°C
Oscillator — Internal oscillator
Automotive Qualification — AEC-Q100 listed in verified distributor result
RoHS — [DATA_NEEDED: RoHS status]
REACH — [DATA_NEEDED: REACH status]
Lead-Free Status — [DATA_NEEDED: lead-free status]

数据手册与资源

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