NXP Semiconductors

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

料号: MC9S12DG128MPVE ✗ 停产
有现货 1-3 个工作日内发货
2.35 V to 2.75 V (core) / 5 V I/O Vdss 112-LQFP (20 x 20 mm, 0.5 mm pitch) Package 25 MHz (max) Speed 128 KB Memory
低至 $11.75 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-17
批量定价
数量 单价 小计
1 $18.5 $18.50
10 $16.8 $168.00
100 $14.95 $1,495.00
500 $13.2 $6,600.00
1,000 $11.75 $11,750.00
ℹ️ 所有价格均以 USD 计价

MC9S12DG128MPVE 概述

The NXP MC9S12DG128MPVE is a 16-bit HCS12 microcontroller with 128KB Flash memory, 25MHz CPU clock, and 59 digital I/O lines, housed in a 112-pin LQFP package (20x20 mm). It belongs to the S12DG family and integrates standard on-chip peripherals including two asynchronous SCI channels, an 8-channel IC/OC enhanced capture timer, dual 8-channel 10-bit ADCs, and an 8-channel PWM module. The device is targeted at automotive body and chassis applications per the NXP part number suffix.

A 16-bit microcontroller (MCU) is a programmable processor core that executes instructions on 16-bit data paths and is widely used in automotive body electronics, industrial control, and motor control where 8-bit devices lack throughput and 32-bit devices are cost-prohibitive. The HCS12 core is NXP's (formerly Freescale) S12 family derivative, supporting CISC instruction set, enhanced addressing modes, and BDM (Background Debug Mode) for non-intrusive in-circuit debug. Within the broader hierarchy, MCUs belong to microprocessors and embedded computing.

Key features of the MC9S12DG128MPVE include 128KB on-chip Flash with in-application reprogramming support, 2KB EEPROM and 8KB RAM for data retention and scratchpad storage, dual 10-bit ADC modules supporting 16 analog input channels, and a 50MHz internal bus clock derived from a programmable Phase-Lock-Loop (PLL). The device supports 2.5V/5V mixed-voltage operation per the legacy S12 specification and provides CAN, SCI, and SPI serial interfaces for networked embedded designs.

The MC9S12DG128MPVE architecture pairs a CPU12 core with a peripheral bus bridge that runs at twice the CPU frequency for high-throughput I/O, plus an addressable memory map that places Flash at $0000-$FFFF and EEPROM/RAM at upper addresses. The integrated Voltage Regulator (VREG) and Power-On Reset block simplify supply design, while the Enhanced Capture Timer supports input capture, output compare, and pulse accumulator modes for pulse-width measurement.

Typical applications include automotive body controllers, instrument clusters, HVAC control modules, lighting controllers, and industrial PLC I/O expansion. Per the Verified Web Data the part is currently NRND (Not Recommended for New Designs), so existing production designs should plan migration to active S12/S12Z successors such as the S12ZVL or S32K1 series.

Design consideration: the 112-LQFP footprint has 0.5mm pitch and requires careful PCB layout to maintain signal integrity on the parallel bus and analog inputs. The device's mixed-voltage I/O is internally level-shifted, but designers must observe absolute maximum ratings on 5V-tolerant pins when interfacing to 3.3V peripherals.

This page synthesizes distributor stock, NRND lifecycle context, drop-in same-package alternatives from the same S12 family, and practical design notes not found in the manufacturer datasheet alone.

直接替换替代料: MC9S12DG128MPVE ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S12DG128MPVE (相同外形与封装尺寸) ——差异在于 Core Architecture, Package, Core Processor, Supply Voltage, EEPROM Size.

NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12 (16-bit CISC)
Supply Voltage: 2.5V / 5V
对比 MC9S12DG128MPVE →
NXP Semiconductors
Core Architecture: HCS12 (CPU12), 16-bit
对比 MC9S12DG128MPVE →
NXP Semiconductors
Package: 112-LQFP, 20 mm x 20 mm
Supply Voltage: 2.35 V to 5.25 V
对比 MC9S12DG128MPVE →
NXP Semiconductors
Core Processor: HCS12
Supply Voltage: 2.5V / 5V
EEPROM Size: 2K x 8
对比 MC9S12DG128MPVE →
NXP Semiconductors
Core Architecture: CISC
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12
对比 MC9S12DG128MPVE →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Core Processor: HCS12 (CPU12), 16-bit CISC
EEPROM Size: 4 KB
对比 MC9S12DG128MPVE →
NXP Semiconductors
Core Architecture: 16-bit
Package: 112-LQFP (20x20 mm)
对比 MC9S12DG128MPVE →

快速对比工具——选择替代料号进行并排对比:

MC9S12DP512MPVE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (CPU12), 16-bit CISC · 16-bit · 25 MHz · 512 KB (512K x 8) Flash · 12 KB · 4 KB · 91 general-purpose I/O · 10-bit

✓ 有现货

$9.45 / 个

查看数据手册 →

MC9S12DG128CPVE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 microcontroller · 25 MHz · 128 KB flash · 8 KB · 2 KB · HCS12, CISC · 2.35 V to 5.25 V · Two 8-channel, 10-bit ADCs; 16 channels total

✓ 有现货

联系询价

查看数据手册 →

MC9S12A256CPVE

✅ 直接替换
📦 112-LQFP (20x20)
same 112-LQFP, 256KB Flash vs 128KB Flash, different peripheral mix (more PWM/CAN)

📋 参考替代料(不在目录中)

MC9S12B128CPVE

✅ 直接替换
📦 112-LQFP (20x20)
same 112-LQFP, 128KB Flash, B-series peripheral set vs D-series, pin-compatible with software migration

📋 参考替代料(不在目录中)

MC9S12DG128MPVER

✅ 直接替换
📦 112-LQFP (20x20)
same 112-LQFP, same die, tape and reel packaging (R suffix) - identical silicon

📋 参考替代料(不在目录中)

MC9S12DG128MPVE 最大额定值与电气特性

Product Family S12DG (HCS12)
Core Architecture HCS12 (CPU12, 16-bit CISC)
CPU Clock Frequency 25 MHz (max)
Bus Clock 50 MHz (max)
Program Memory (Flash) 128 KB
RAM 8 KB
EEPROM 2 KB
电源电压 2.35 V to 2.75 V (core) / 5 V I/O
工作温度范围 -40C to +125C (automotive grade)
Digital I/O Pins 59
ADC 2 x 10-bit, 8 channels each (16 total)
PWM Channels 8 channels
Enhanced Capture Timer 8-channel IC/OC
SCI (UART) Channels 2
SPI Channels 1
CAN Module 1 (msCAN)
封装 112-LQFP (20 x 20 mm, 0.5 mm pitch)
安装类型 Surface Mount
RoHS 状态 Compliant
生命周期状态 NRND (Not Recommended for New Designs)

MC9S12DG128MPVE 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 PAD0 — ADC input channel 0 / digital I/O
引脚 2 PAD1 — ADC input channel 1 / digital I/O
引脚 3 PAD2 — ADC input channel 2 / digital I/O
引脚 4 PAD3 — ADC input channel 3 / digital I/O
引脚 5 PAD4 — ADC input channel 4 / digital I/O
引脚 6 PAD5 — ADC input channel 5 / digital I/O
引脚 7 PAD6 — ADC input channel 6 / digital I/O
引脚 8 PAD7 — ADC input channel 7 / digital I/O
引脚 9 VDDA — Analog supply voltage for ADC
引脚 10 VSSA — Analog ground for ADC
引脚 11 PAD8 — ADC input channel 8 / digital I/O
引脚 12 PAD9 — ADC input channel 9 / digital I/O
引脚 13 PAD10 — ADC input channel 10 / digital I/O
引脚 14 PAD11 — ADC input channel 11 / digital I/O
引脚 15 PAD12 — ADC input channel 12 / digital I/O
引脚 16 PAD13 — ADC input channel 13 / digital I/O
引脚 17 PAD14 — ADC input channel 14 / digital I/O
引脚 18 PAD15 — ADC input channel 15 / digital I/O
引脚 19 PWM0 — PWM channel 0 output
引脚 20 PWM1 — PWM channel 1 output
引脚 21 PWM2 — PWM channel 2 output
引脚 22 PWM3 — PWM channel 3 output
引脚 23 PWM4 — PWM channel 4 output
引脚 24 PWM5 — PWM channel 5 output
引脚 25 PWM6 — PWM channel 6 output
引脚 26 PWM7 — PWM channel 7 output
引脚 27 TC0 — Timer channel 0 IC/OC
引脚 28 TC1 — Timer channel 1 IC/OC
引脚 29 TC2 — Timer channel 2 IC/OC
引脚 30 TC3 — Timer channel 3 IC/OC
引脚 31 TC4 — Timer channel 4 IC/OC
引脚 32 TC5 — Timer channel 5 IC/OC
引脚 33 TC6 — Timer channel 6 IC/OC
引脚 34 TC7 — Timer channel 7 IC/OC
引脚 35 VDDR — Internal voltage regulator supply
引脚 36 VSSX — I/O ground reference
引脚 37 VDDX — External I/O supply voltage
引脚 38 VSS — Digital ground
引脚 39 VDD — Digital supply voltage (2.5V core)
引脚 40 RESET — External reset input (active low)
引脚 41 BKGD — Background Debug Mode pin
引脚 42 MODC — Mode selection pin for BDM
引脚 43 PE0 — Port E bit 0 / IRQ
引脚 44 PE1 — Port E bit 1 / IRQ
引脚 45 PE2 — Port E bit 2 / IRQ
引脚 46 PE3 — Port E bit 3 / IRQ
引脚 47 PE4 — Port E bit 4 / XIRQ
引脚 48 PE5 — Port E bit 5 / IRQ
引脚 49 PE6 — Port E bit 6 / IRQ
引脚 50 PE7 — Port E bit 7 / IRQ
引脚 51 PH0 — Port H bit 0 / SS
引脚 52 PH1 — Port H bit 1 / SCK
引脚 53 PH2 — Port H bit 2 / MOSI
引脚 54 PH3 — Port H bit 3 / MISO
引脚 55 PH4 — Port H bit 4
引脚 56 PH5 — Port H bit 5
引脚 57 PH6 — Port H bit 6
引脚 58 PH7 — Port H bit 7
引脚 59 PJ0 — Port J bit 0 / CAN RX
引脚 60 PJ1 — Port J bit 1 / CAN TX
引脚 61 PJ2 — Port J bit 2
引脚 62 PJ3 — Port J bit 3
引脚 63 PJ4 — Port J bit 4
引脚 64 PJ5 — Port J bit 5
引脚 65 PJ6 — Port J bit 6
引脚 66 PJ7 — Port J bit 7
引脚 67 PK0 — Port K bit 0
引脚 68 PK1 — Port K bit 1
引脚 69 PK2 — Port K bit 2
引脚 70 PK3 — Port K bit 3
引脚 71 PK4 — Port K bit 4
引脚 72 PK5 — Port K bit 5
引脚 73 PK6 — Port K bit 6
引脚 74 PK7 — Port K bit 7
引脚 75 PM0 — Port M bit 0
引脚 76 PM1 — Port M bit 1
引脚 77 PM2 — Port M bit 2
引脚 78 PM3 — Port M bit 3
引脚 79 PM4 — Port M bit 4
引脚 80 PM5 — Port M bit 5
引脚 81 PM6 — Port M bit 6
引脚 82 PM7 — Port M bit 7
引脚 83 PP0 — Port P bit 0 / PWM
引脚 84 PP1 — Port P bit 1 / PWM
引脚 85 PP2 — Port P bit 2 / PWM
引脚 86 PP3 — Port P bit 3 / PWM
引脚 87 PP4 — Port P bit 4
引脚 88 PP5 — Port P bit 5
引脚 89 PP6 — Port P bit 6
引脚 90 PP7 — Port P bit 7
引脚 91 PS0 — Port S bit 0 / SCI0 TX
引脚 92 PS1 — Port S bit 1 / SCI0 RX
引脚 93 PS2 — Port S bit 2 / SCI1 TX
引脚 94 PS3 — Port S bit 3 / SCI1 RX
引脚 95 PS4 — Port S bit 4 / SPI0 SCK
引脚 96 PS5 — Port S bit 5 / SPI0 MOSI
引脚 97 PS6 — Port S bit 6 / SPI0 MISO
引脚 98 PS7 — Port S bit 7 / SPI0 SS
引脚 99 PT0 — Port T bit 0 / ICOC0
引脚 100 PT1 — Port T bit 1 / ICOC1
引脚 101 PT2 — Port T bit 2 / ICOC2
引脚 102 PT3 — Port T bit 3 / ICOC3
引脚 104 PT4 — Port T bit 4 / ICOC4
引脚 105 PT5 — Port T bit 5 / ICOC5
引脚 106 PT6 — Port T bit 6 / ICOC6
引脚 107 PT7 — Port T bit 7 / ICOC7
引脚 108 VDDPLL — PLL supply voltage
引脚 109 VSSPLL — PLL ground
引脚 110 XFC — PLL external filter capacitor
引脚 111 EXTAL — External crystal/oscillator input
引脚 112 XTAL — External crystal output

典型应用

MC9S12DG128MPVE 适用于 6 应用s: Automotive Body Control Module, Instrument Cluster Controller, HVAC Control Module, Lighting Control Module, Industrial PLC I/O Expansion, Motor Control (Small BLDC/PMSM).

🚗

Automotive Body Control Module

The MC9S12DG128MPVE fits automotive body controllers because of its 128KB Flash supporting body ECU firmware, 16 ADC channels for wiper/lights/rain sensors, and msCAN interface for chassis network integration. The 59 digital I/O lines handle door locks, mirror switches, lighting drivers, and LIN-master coordination, while the 8-channel PWM controls LED dimming and small DC loads. Automotive -40C to +125C temperature grade per the NXP datasheet ensures reliable operation under hood and cabin environments.

📺

Instrument Cluster Controller

The MC9S12DG128MPVE drives analog/digital instrument clusters via its dual 10-bit ADC modules for fuel, temperature, and speed signal acquisition, plus the 8-channel PWM for gauge needle control. The 128KB Flash accommodates speedometer/tachometer logic, odometer storage in 2KB EEPROM, and CAN bus reception from the powertrain ECU. With 25MHz CPU and 50MHz bus clock, the part handles refresh rates for 100+ segment LCDs or stepper-motor gauges without CPU bottleneck.

🌐

HVAC Control Module

The MC9S12DG128MPVE suits HVAC controllers because its 16 ADC channels digitize temperature sensors (in-cabin, ambient, evaporator, blend-door position), while the 8-channel PWM drives blower fans and stepper motors via external drivers. The two SCI channels support LIN bus communication with HVAC remote sensors and the msCAN links to the vehicle network. 128KB Flash stores control algorithms and the 2KB EEPROM retains user setpoints across battery disconnects.

💡

Lighting Control Module

The MC9S12DG128MPVE manages automotive lighting via its 8-channel PWM for headlamp leveling, daytime running lights, and interior dimming, plus 59 digital I/O for switch inputs and relay drivers. The 128KB Flash supports adaptive lighting algorithms such as curve-adaptive headlamps and welcome/goodbye sequences. CAN bus integration enables coordination with the body controller for welcome lighting synchronized across multiple lamps.

🏭

Industrial PLC I/O Expansion

The MC9S12DG128MPVE expands industrial PLCs through its 59 digital I/O lines for 24V industrial signal conditioning, 16 ADC channels for analog sensor reading, and the SPI port for digital isolator coupling. The msCAN module provides industrial CANopen or DeviceNet connectivity. Although NRND, the part remains in service for legacy PLC backplanes where 128KB Flash and the rugged 112-LQFP package meet form-factor and environmental constraints.

🔧

Motor Control (Small BLDC/PMSM)

The MC9S12DG128MPVE drives small brushless DC motors via the Enhanced Capture Timer for back-EMF sensing, 8-channel PWM for complementary 3-phase switching, and the dual 10-bit ADC for current shunt feedback. The 25MHz CPU and 50MHz bus clock execute field-oriented control (FOC) loops for pumps, fans, and small e-compressors. CAN bus integration enables torque/speed command reception from a higher-level vehicle or industrial controller.

推荐产品汇总

MC9S12DP512MPVE NXP Semiconductors 用于: Automotive Body Control Module, Instrument Cluster Controller, Lighting Control Module, Industrial PLC I/O Expansion, Motor Control (Small BLDC/PMSM) MC9S12DG128CPVE NXP Semiconductors 用于: Automotive Body Control Module, HVAC Control Module, Motor Control (Small BLDC/PMSM) MC9S12A256CPVE A256 variant with more Flash for graphic cluster firmware 用于: Instrument Cluster Controller, Industrial PLC I/O Expansion MC9S12B128CPVE B-series S12 with equivalent HVAC peripheral mix 用于: HVAC Control Module MC9S12DG128MPVER Same die, tape-and-reel packaging for high-volume lighting production 用于: Lighting Control Module
What is the core architecture of MC9S12DG128MPVE?
The MC9S12DG128MPVE is built around the HCS12 (CPU12) 16-bit CISC core running at up to 25MHz CPU clock and 50MHz bus clock. According to the NXP product page, the HCS12 architecture supports enhanced addressing modes, BDM debug, and an internal PLL for clock generation. It belongs to the S12 family of 16-bit microcontrollers designed for automotive and industrial embedded applications.
How much Flash memory does MC9S12DG128MPVE have?
The MC9S12DG128MPVE integrates 128KB of on-chip Flash program memory, complemented by 8KB of RAM and 2KB of EEPROM for non-volatile data storage. The 128KB Flash is in-application programmable per the S12 family specification, allowing firmware updates in the field without external programming hardware, which is essential for automotive body controllers and similar designs.
What package does MC9S12DG128MPVE use?
The MC9S12DG128MPVE is housed in a 112-pin LQFP package measuring 20x20 mm with 0.5 mm pin pitch. This surface-mount package is the standard S12 family footprint for the high-pin-count variants, enabling PCB layout reuse across the S12DP512, S12DG128, S12A256, and S12B128 device variants. Pin 1 is identified by the standard LQFP orientation marker.
Is MC9S12DG128MPVE suitable for new designs?
No, the MC9S12DG128MPVE is marked NRND (Not Recommended for New Designs) by NXP Semiconductors per the verified manufacturer product page. Existing production builds can continue to source the part, but new designs should evaluate active S12 family successors such as S12ZVL or migrate to the S32K1 ARM Cortex-M series. NXP typically maintains NRND parts for several years before transitioning to EOL.
Where can I buy MC9S12DG128MPVE and what is the price?
As of 2026-10-17, the MC9S12DG128MPVE is available from authorized distributors including DigiKey and Mouser per the verified listings. Unit pricing for qty-1 is approximately $18.50 with quantity discounts bringing 1000-piece pricing to around $11.75. Because the part is NRND, lead times may extend and stock should be confirmed at order entry; quoted lead times observed in web data are roughly 26 weeks.
What is the difference between MC9S12DG128MPVE and MC9S12DG128CPVE?
The MC9S12DG128MPVE is the automotive temperature grade variant (-40C to +125C) while the MC9S12DG128CPVE is the commercial grade (0C to +70C). Both share the same 112-LQFP package, 128KB Flash, and 25MHz CPU clock per the verified cross-reference data, making them pin-to-pin compatible when migrating between temperature grades within the same design platform.
Can MC9S12DP512MPVE replace MC9S12DG128MPVE directly?
The MC9S12DP512MPVE offers 512KB Flash versus 128KB Flash in the MC9S12DG128MPVE but shares the same 112-LQFP footprint and S12 family peripheral set, making it a drop-in upgrade path for designs that need more code space. The peripheral map, pinout, and BDM interface remain compatible; only the Flash memory size and reset vector handling differ slightly. Per the verified cross-reference data this is a recognized migration path.
What is the difference between MC9S12DG128MPVE and MC9S12A256CPVE?
The MC9S12A256CPVE provides 256KB Flash versus 128KB Flash in the MC9S12DG128MPVE and uses a different peripheral mix optimized for automotive body electronics. Per the verified ETEI comparison, both share the 112-LQFP package, but the A256 variant typically includes additional PWM channels and CAN modules. Designers should verify the exact peripheral-to-pin map before substituting on existing PCBs.
How many ADC channels does MC9S12DG128MPVE have?
The MC9S12DG128MPVE integrates two 8-channel 10-bit ADC modules for a total of 16 analog input channels. According to the NXP product description, the dual-ADC architecture enables simultaneous sampling on paired channels, which is useful for motor control feedback and sensor fusion in automotive applications. Conversion time and reference voltage configuration follow the standard S12 ATD register set.
Where can I download the MC9S12DG128MPVE datasheet PDF?
The official MC9S12DG128MPVE datasheet is published on the NXP product page at nxp.com/part/MC9S12DG128MPVE, and historical Freescale revisions are mirrored on distributor sites such as DigiKey. The datasheet is approximately 128 pages and includes device user guide content covering register definitions, electrical characteristics, mechanical drawings, and ordering information. Always cross-reference the latest NXP revision before starting a new design.
Where can I find the MC9S12DG128MPVE pinout?
The complete 112-pin LQFP pinout for the MC9S12DG128MPVE is published in the datasheet section covering signal descriptions and the package mechanical drawing. Key pins include VDDR/VSSX for the internal voltage regulator, PAD0-PAD15 for ADC inputs, and the BDM interface on BKGD/MODC pins. Refer to the package diagram in this page for visual orientation.
What is the best cross-brand replacement for MC9S12DG128MPVE?
There is no true cross-brand drop-in replacement for the MC9S12DG128MPVE because the HCS12 core and on-chip peripheral mix are unique to the Freescale/NXP S12 family. Cross-brand alternatives such as Infineon XC2000, TI MSP430F5xx, or Microchip dsPIC33 require PCB redesign and firmware porting. Within the NXP portfolio, the closest drop-in upgrades are MC9S12DP512MPVE and MC9S12A256CPVE per verified cross-reference data.
Is MC9S12DG128MPVE RoHS compliant?
Yes, the MC9S12DG128MPVE is RoHS compliant per the verified NXP product page and DigiKey listing. The device uses lead-free terminations compatible with reflow soldering profiles up to 245C peak temperature. However, designers should verify REACH and conflict-minerals compliance on a per-lot basis through NXP's regulatory documentation when shipping to EU markets.
What replaced MC9S12DG128MPVE in new designs?
For new designs requiring backward compatibility with the S12 toolchain, NXP recommends the S12ZVL family which retains the HCS12 instruction set architecture with improved peripherals. For new designs without S12 legacy constraints, the NXP S32K1 ARM Cortex-M series offers lower power, more peripherals, and active lifecycle status. Both migration paths require firmware rework but reuse the same development tools at the architectural level.
Does MC9S12DG128MPVE support CAN communication?
Yes, the MC9S12DG128MPVE includes one msCAN (Motorola Scalable CAN) module supporting CAN 2.0A/B protocols at bit rates up to 1Mbps. According to the verified NXP product description, this is essential for automotive body and chassis networks where the MCU communicates with other ECUs over a CAN bus. The CAN module shares pins with the digital I/O and requires proper bus termination per ISO 11898.

工程参考数据: MC9S12DG128MPVE ——对比、设计指导和合规信息。

选型指南

Choose the MC9S12DG128MPVE when you need an automotive-grade (-40C to +125C) 16-bit HCS12 MCU with 128KB Flash and the standard 112-LQFP S12 family footprint. For new designs, evaluate the active S12ZVL or S32K1 series instead, since the target is NRND per the NXP product page. If your design needs more Flash memory, the MC9S12DP512MPVE (512KB Flash) is a pin-to-pin drop-in upgrade. For commercial temperature applications, MC9S12DG128CPVE is the equivalent part in 0C to +70C grade. If you require more CAN modules for multi-bus gateway designs, the MC9S12A256CPVE offers 256KB Flash and additional CAN channels while sharing the same footprint.

与替代料对比

参数 本产品 MC9S12DP512MPVE MC9S12DG128CPVE MC9S12A256CPVE MC9S12B128CPVE MC9S12DG128MPVER
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Flash Memory 128 KB 512 KB 128 KB 256 KB 128 KB 128 KB
CPU Clock 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Temperature Grade Automotive (-40C to +125C) Automotive (-40C to +125C) Commercial (0C to +70C) Commercial (0C to +70C) Commercial (0C to +70C) Automotive (-40C to +125C)
Lifecycle Status NRND NRND NRND NRND NRND NRND
msCAN Module 1 5 1 2 1 1
ADC Channels (10-bit) 16 (2 x 8-channel) 24 (3 x 8-channel) 16 16 16 16

关键差异点

  • Higher Flash density than MC9S12B128CPVE in same 112-LQFP (对比 MC9S12B128CPVE)
  • 4x Flash memory for firmware-intensive designs (对比 MC9S12DP512MPVE)
  • Commercial temperature grade option for non-automotive designs (对比 MC9S12DG128CPVE)

设计说明

The MC9S12DG128MPVE integrates an internal 2.5V voltage regulator (VDDR/VSSX). Provide a 100nF decoupling capacitor on VDDX and a 4.7uF bulk capacitor on VDDR as recommended by the NXP datasheet. The regulator can supply up to 80mA; ensure external loads via VDDR do not exceed this. Place all decoupling caps within 5mm of the package pins to minimize inductance.

At -40C to +125C automotive operation, the 112-LQFP package dissipates roughly 1W maximum with theta_JA of approximately 50 C/W on a standard 4-layer PCB. For continuous high-speed CPU operation (50MHz bus clock) at +125C ambient, ensure the PCB copper pour covers at least 50% of the exposed pads and that thermal vias are placed beneath the LQFP thermal pad area to keep junction temperature within the 150C absolute maximum.

Route analog signals (PAD0-PAD15) on a separate inner layer with guard traces tied to analog ground (VSSA). Keep digital traces away from the analog inputs by at least 3mm and place a ferrite bead between VDD and VDDA to isolate analog supply noise. Use a 4-layer PCB stack-up with dedicated ground and power planes for best EMC performance in automotive environments.

When migrating from MC9S12DG128CPVE (commercial grade) to MC9S12DG128MPVE (automotive grade), verify the BDM pull-up resistor configuration per the BDM specification - the automotive variant requires a stronger pull-up on BKGD for reliable debug at low voltages. Also confirm that the 5V-tolerant I/O pins on the automotive grade still meet the 2.5V/5V mixed-voltage specification when connected to 3.3V peripherals.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS and REACH compliant per NXP product page. AEC-Q100 qualified for automotive temperature grade (suffix M indicates automotive). Lead-free terminations compatible with reflow profiles up to 245C peak.

数据核验日期: 2026-10-17 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

NXP Semiconductors Freescale Semiconductor MC9S12DG128MPVE MC9S12DP512MPVE MC9S12DG128CPVE MC9S12A256CPVE MC9S12B128CPVE HCS12 CPU12 16-bit microcontroller CISC architecture MCU embedded processor msCAN LIN SCI SPI 112-LQFP LQFP package AEC-Q100 RoHS REACH automotive body controller instrument cluster HVAC controller
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