MC9S12DG128MPVE vs MC9S12DG128MPV 对比

详细并排对比 MC9S12DG128MPVE 出自 NXP Semiconductors 和 MC9S12DG128MPV 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DG128MPVE MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE Nrnd
NXP Semiconductors
MC9S12DG128MPV MC9S12DG128MPV - 16-bit HCS12 MCU 128KB Flash 112-LQFP | NXP

MC9S12DG128MPV - 16-bit HCS12 MCU 128KB Flash 112-LQFP | NXP

MC9S12DG128MPV Obsolete

规格对比

参数 MC9S12DG128MPVE MC9S12DG128MPV
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 Obsolete
库存状态 有库存 有库存
单价(USD) $11.75 $0.00
Product Family S12DG (HCS12) —
Core Architecture HCS12 (CPU12, 16-bit CISC) —
CPU Clock Frequency 25 MHz (max) —
Bus Clock 50 MHz (max) —
Program Memory (Flash) 128 KB —
RAM 8 KB —
EEPROM 2 KB —
电源电压 2.35 V to 2.75 V (core) / 5 V I/O 2.5V / 5V
工作温度范围 -40C to +125C (automotive grade) —
Digital I/O Pins 59 —
ADC 2 x 10-bit, 8 channels each (16 total) —
PWM Channels 8 channels —
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Channels 2 —
SPI Channels 1 —
CAN Module 1 (msCAN) —
封装 112-LQFP (20 x 20 mm, 0.5 mm pitch) —
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant —
生命周期状态 NRND (Not Recommended for New Designs) —
Core Processor — HCS12
Core Size — 16-Bit
Architecture — CISC
Speed — 25 MHz
Program Memory Size — 128KB (128K x 8)
Program Memory Type — FLASH
RAM Size — 8K x 8
EEPROM Size — 2K x 8
Number of I/O — 91
Connectivity — CANbus, I2C, SCI, SPI
Peripherals — PWM, WDT
ADC Resolution — 10-bit
封装 / 外壳 — 112-LQFP (20 x 20 mm)
Part Status — Obsolete
Series — HCS12 (MC9S12D family)

数据手册与资源

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