MC9S12DG128MPVE vs MC9S12DT128MPVE 对比

详细并排对比 MC9S12DG128MPVE 出自 NXP Semiconductors 和 MC9S12DT128MPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DG128MPVE MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE - 16-bit HCS12 MCU, 128KB Flash, 112-LQFP | NXP

MC9S12DG128MPVE Nrnd
NXP Semiconductors
MC9S12DT128MPVE MC9S12DT128MPVE - 16-bit HCS12 MCU, 128KB Flash, LQFP-112 | NXP

MC9S12DT128MPVE - 16-bit HCS12 MCU, 128KB Flash, LQFP-112 | NXP

MC9S12DT128MPVE Nrnd

规格对比

参数 MC9S12DG128MPVE MC9S12DT128MPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $11.75 $36.50
Product Family S12DG (HCS12) —
Core Architecture HCS12 (CPU12, 16-bit CISC) 16-bit
CPU Clock Frequency 25 MHz (max) —
Bus Clock 50 MHz (max) —
Program Memory (Flash) 128 KB —
RAM 8 KB 8KB (8K x 8)
EEPROM 2 KB 2KB (2K x 8)
电源电压 2.35 V to 2.75 V (core) / 5 V I/O —
工作温度范围 -40C to +125C (automotive grade) —
Digital I/O Pins 59 —
ADC 2 x 10-bit, 8 channels each (16 total) —
PWM Channels 8 channels 8-channel
Enhanced Capture Timer 8-channel IC/OC —
SCI (UART) Channels 2 —
SPI Channels 1 —
CAN Module 1 (msCAN) —
封装 112-LQFP (20 x 20 mm, 0.5 mm pitch) 112-LQFP (20x20 mm)
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant —
生命周期状态 NRND (Not Recommended for New Designs) NRND (Not Recommended for New Designs)
Core — HCS12
Maximum Clock Speed — 25 MHz
Flash Program Memory — 128KB (128K x 8)
Supply Voltage Range — 2.35 V to 5.25 V
Number of I/O — 91
ADC Resolution — 10-bit
ADC Channels — 16 (two 8-channel 10-bit ADCs)
Serial Interfaces — 2x SCI, IIC
Timers — 8-channel IC/OC enhanced capture timer
工作温度 — -40C to +125C
Terminal Form — Gull Wing
Temperature Grade — Automotive
Oscillator Type — Internal

数据手册与资源

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