MC9S12DJ128BCPV vs MC9S12DT128BCPV 对比

详细并排对比 MC9S12DJ128BCPV 出自 NXP Semiconductors 和 MC9S12DT128BCPV 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DJ128BCPV MC9S12DJ128BCPV - 16-bit 25MHz HCS12 MCU 128KB Flash | NXP

MC9S12DJ128BCPV - 16-bit 25MHz HCS12 MCU 128KB Flash | NXP

MC9S12DJ128BCPV ✓ 量产中
NXP Semiconductors
MC9S12DT128BCPV MC9S12DT128BCPV - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DT128BCPV - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP

MC9S12DT128BCPV ✓ 量产中

规格对比

参数 MC9S12DJ128BCPV MC9S12DT128BCPV
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $10.05 $18.45
Core HCS12 (16-bit CISC) HCS12 (16-bit CISC)
CPU Speed 25 MHz —
Program Memory 128 KB (128K x 8) Flash —
RAM 8 KB —
EEPROM 2 KB —
Operating Voltage 2.5 V / 5 V —
封装 112-LQFP (20x20 mm) 112-LQFP (20x20 mm)
安装类型 Surface Mount Surface Mount
Number of I/O 91 (approximate, see datasheet) —
CAN Controllers 2 (msCAN 2.0A/B) —
SCI / SPI / I2C 2 SCI, 1 SPI, 1 I2C —
ADC 10-bit, 8 channels [DATA_NEEDED: ADC resolution and channels]
PWM Channels 8 —
Timers 16-bit, multiple channels —
工作温度 -40C to +85C (industrial) or +125C automotive, see datasheet -40 C to +85 C (industrial)
RoHS 状态 Compliant (lead-free, per NXP product page) Compliant
Debug Interface BDM (Background Debug Mode) Background Debug Mode (BDM)
Program Memory (Flash) — 128 KB (128K x 8)
RAM Size — 8 KB (8K x 8)
EEPROM Size — [DATA_NEEDED: EEPROM size]
Maximum Bus Clock — 25 MHz
Number of I/O Pins — 91
电源电压 — 2.5 V / 5 V mixed (core 2.5V from internal regulator)
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 status]
CAN Modules — [DATA_NEEDED: number of CAN modules]
MSL 等级 — [DATA_NEEDED: MSL level]

数据手册与资源

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