NXP Semiconductors
MC9S12DJ128BCPV - 16-bit 25MHz HCS12 MCU 128KB Flash | NXP
料号： MC9S12DJ128BCPV ✓ 量产中
有现货
1-3 个工作日内发货
2.5 V / 5 V Vdss
112-LQFP (20x20 mm) Package
25 MHz Speed
128 KB (128K x 8) Flash Memory
低至 $10.05
USD / 件
最小起订量： 1 |
价格更新于： 2026-10-17
批量定价
| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.4 | $164.00 |
| 100 | $14.2 | $1,420.00 |
| 500 | $12.1 | $6,050.00 |
| 1,000 | $10.05 | $10,050.00 |
ℹ️ 所有价格均以 USD 计价
MC9S12DJ128BCPV 概述
The NXP MC9S12DJ128BCPV is a 16-bit HCS12 microcontroller IC running at 25 MHz with 128 KB (128K x 8) of on-chip Flash and a 112-pin LQFP (20x20 mm) package. It belongs to NXP's (formerly Freescale) HCS12 automotive/industrial MCU family and targets applications that need CAN, SCI/SPI, and analog front-end integration on a single die.
A microcontroller (MCU) is a programmable system-on-a-chip that integrates a CPU, RAM, non-volatile memory (Flash/EEPROM), and peripherals such as timers, ADC, PWM, and communication controllers. The HCS12 sits in the 16-bit MCU category, sitting hierarchically above 8-bit MCUs (e.g., HC11, 8051) and below 32-bit Cortex-M microcontrollers. HCS12 devices use a CISC HCS12 core with BDM (Background Debug Mode) for non-intrusive in-system programming and debug, making them popular in automotive body and chassis modules as well as industrial control.
Key features of the MC9S12DJ128BCPV include the 25 MHz HCS12 CPU core with integrated third-generation Flash, 8 KB of RAM, 2 KB of EEPROM, dual CAN 2.0A/B controllers (msCAN), two SCI, one SPI, an 8-channel 10-bit ADC, an 8-channel PWM, and the BDM/JTAG debug interface. The Flash supports in-application re-programming via the integrated MSCAN module, allowing firmware updates on deployed units.
Architecturally, the device uses a 16-bit HCS12 core with an enhanced XGATE co-processor-free design (the B variant adds 8 KB RAM compared with earlier revs), AGDT-style lockout for safety-critical code, and the 112-LQFP exposes the full peripheral set. The 128 KB Flash is organized as 128K x 8 (single bank), enabling easier in-application reprogramming.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, industrial CAN nodes, and appliance control. The dual CAN interface makes it especially suitable for in-vehicle networking (LIN-CAN gateways).
When designing with this part, allocate adequate decoupling on each VDDR/VSSX pair (4.7 uF bulk + 0.1 uF per pin), respect the PLL electrical characteristics when configuring bus speed up to 25 MHz, and use BDM for field firmware upgrade. Avoid driving unused CMOS inputs above VDDX + 0.3 V to prevent latch-up per the device user guide.
This page synthesizes current distributor pricing, drop-in alternatives from the MC9S12 family, and practical design notes not found on the standalone NXP product page.
A microcontroller (MCU) is a programmable system-on-a-chip that integrates a CPU, RAM, non-volatile memory (Flash/EEPROM), and peripherals such as timers, ADC, PWM, and communication controllers. The HCS12 sits in the 16-bit MCU category, sitting hierarchically above 8-bit MCUs (e.g., HC11, 8051) and below 32-bit Cortex-M microcontrollers. HCS12 devices use a CISC HCS12 core with BDM (Background Debug Mode) for non-intrusive in-system programming and debug, making them popular in automotive body and chassis modules as well as industrial control.
Key features of the MC9S12DJ128BCPV include the 25 MHz HCS12 CPU core with integrated third-generation Flash, 8 KB of RAM, 2 KB of EEPROM, dual CAN 2.0A/B controllers (msCAN), two SCI, one SPI, an 8-channel 10-bit ADC, an 8-channel PWM, and the BDM/JTAG debug interface. The Flash supports in-application re-programming via the integrated MSCAN module, allowing firmware updates on deployed units.
Architecturally, the device uses a 16-bit HCS12 core with an enhanced XGATE co-processor-free design (the B variant adds 8 KB RAM compared with earlier revs), AGDT-style lockout for safety-critical code, and the 112-LQFP exposes the full peripheral set. The 128 KB Flash is organized as 128K x 8 (single bank), enabling easier in-application reprogramming.
Typical applications include automotive body controllers, instrument clusters, HVAC modules, industrial CAN nodes, and appliance control. The dual CAN interface makes it especially suitable for in-vehicle networking (LIN-CAN gateways).
When designing with this part, allocate adequate decoupling on each VDDR/VSSX pair (4.7 uF bulk + 0.1 uF per pin), respect the PLL electrical characteristics when configuring bus speed up to 25 MHz, and use BDM for field firmware upgrade. Avoid driving unused CMOS inputs above VDDX + 0.3 V to prevent latch-up per the device user guide.
This page synthesizes current distributor pricing, drop-in alternatives from the MC9S12 family, and practical design notes not found on the standalone NXP product page.
直接替换替代料： MC9S12DJ128BCPV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S12DJ128BCPV （相同外形与封装尺寸） ——差异在于 Package, ADC, Operating Temperature, Supply Voltage, PWM Channels.
NXP Semiconductors
Package: 112-LQFP (20 x 20 mm)
ADC: 8-channel, 10-bit, ~6 us conversion
Operating Temperature: -40 C to +105 C (industrial)
对比 MC9S12DJ128BCPV →
NXP Semiconductors
Package: 80-QFP (PQFP, 14x14 mm)
Supply Voltage: 2.5 V / 5 V (dual voltage)
对比 MC9S12DJ128BCPV →
NXP Semiconductors
Package: 112-pin LQFP (20x20)
ADC: Two 8-channel, 10-bit ADCs
对比 MC9S12DJ128BCPV →
NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial)
Supply Voltage: 2.5 V / 5 V mixed (core 2.5V from internal regulator)
对比 MC9S12DJ128BCPV →
NXP Semiconductors
Package: 112-pin LQFP (20x20 mm)
ADC: 2x 8-channel, 10-bit
Operating Temperature: -40C to +85C (industrial, per 'P' suffix family)
对比 MC9S12DJ128BCPV →
快速对比工具——选择替代料号进行并排对比：
MC9S12DJ128CPVE
✅ 直接替换NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 · 16 bit · 25 MHz · 128 KB (128K x 8) Flash · 112-LQFP (20 x 20 mm) · Surface Mount
✓ 有现货
$19.75 / 个
查看数据手册 →MC9S12DG128BCPV
✅ 直接替换📦 112-LQFP (20x20)
same 112-LQFP, 128KB Flash; single msCAN vs dual (this part has 1 CAN)
📋 参考替代料（不在目录中）
MC9S12DT128BCPV
✅ 直接替换NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 128 KB (128K x 8) · 8 KB (8K x 8) · 25 MHz · 91 · 112-LQFP (20x20 mm) · 2.5 V / 5 V mixed (core 2.5V from internal regulator)
✓ 有现货
$18.45 / 个
查看数据手册 →MC9S12DB128BCPV
✅ 直接替换NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128 KB (128K x 8) Flash · 8 KB · 2 KB · 112-LQFP (20 x 20 mm) · Surface Mount
✓ 有现货
$14.2 / 个
查看数据手册 →MC9S12DT256CPVE
✅ 直接替换NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (CPU12 CISC) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 12 KB · 4 KB · 16-bit · 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
✓ 有现货
$20.85 / 个
查看数据手册 →MC9S12DP512CPVE
✅ 直接替换NXP Semiconductors
📦 112-LQFP (20x20)
16-bit HCS12 CISC microcontroller · 25 MHz · 512 KB · 12 KB · 4 KB · Two 8-channel, 10-bit ADCs · 2 asynchronous serial communication interfaces · 8-channel IC/OC enhanced capture timer
✓ 有现货
联系询价
查看数据手册 →MC9S12DJ128BCPV 最大额定值与电气特性
| Core | HCS12 (16-bit CISC) |
| CPU Speed | 25 MHz |
| Program Memory | 128 KB (128K x 8) Flash |
| RAM | 8 KB |
| EEPROM | 2 KB |
| Operating Voltage | 2.5 V / 5 V |
| 封装 | 112-LQFP (20x20 mm) |
| 安装类型 | Surface Mount |
| Number of I/O | 91 (approximate, see datasheet) |
| CAN Controllers | 2 (msCAN 2.0A/B) |
| SCI / SPI / I2C | 2 SCI, 1 SPI, 1 I2C |
| ADC | 10-bit, 8 channels |
| PWM Channels | 8 |
| Timers | 16-bit, multiple channels |
| 工作温度 | -40C to +85C (industrial) or +125C automotive, see datasheet |
| RoHS 状态 | Compliant (lead-free, per NXP product page) |
| Debug Interface | BDM (Background Debug Mode) |
MC9S12DJ128BCPV 引脚配置
| 引脚 1 | PA0 — Port A bit 0 / PWM channel |
| 引脚 2 | PA1 — Port A bit 1 / PWM channel |
| 引脚 3 | PA2 — Port A bit 2 / PWM channel |
| 引脚 4 | PA3 — Port A bit 3 / PWM channel |
| 引脚 5 | PA4 — Port A bit 4 |
| 引脚 6 | PA5 — Port A bit 5 |
| 引脚 7 | PA6 — Port A bit 6 |
| 引脚 8 | PA7 — Port A bit 7 |
| 引脚 9 | VDDA — Analog supply |
| 引脚 10 | VSSA — Analog ground |
| 引脚 11 | VRH — ADC high reference |
| 引脚 12 | VRL — ADC low reference |
| 引脚 13 | PAD8 — Port AD bit 0 (ADC input) |
| 引脚 14 | PAD9 — Port AD bit 1 (ADC input) |
| 引脚 15 | PAD10 — Port AD bit 2 (ADC input) |
| 引脚 16 | PAD11 — Port AD bit 3 (ADC input) |
| 引脚 17 | PAD12 — Port AD bit 4 (ADC input) |
| 引脚 18 | PAD13 — Port AD bit 5 (ADC input) |
| 引脚 19 | PAD14 — Port AD bit 6 (ADC input) |
| 引脚 20 | PAD15 — Port AD bit 7 (ADC input) |
| 引脚 21 | VDDX — Digital I/O supply |
| 引脚 22 | VSSX — Digital I/O ground |
| 引脚 23 | VDDR — Internal regulator input |
| 引脚 24 | VSSR — Internal regulator ground |
| 引脚 25 | VDDPLL — PLL supply |
| 引脚 26 | VSSPLL — PLL ground |
| 引脚 27 | XFC — PLL loop filter capacitor |
| 引脚 28 | RESET — External reset input (active low) |
| 引脚 29 | BKGD — Background Debug Mode (BDM) |
| 引脚 30 | MODC — Mode select |
| 引脚 31 | TEST — Test mode pin (tie to VSS in production) |
| 引脚 32 | NO CONNECT — Reserved / not connected on this part |
| 引脚 33 | NO CONNECT — Reserved |
| 引脚 34 | NO CONNECT — Reserved |
| 引脚 35 | NO CONNECT — Reserved |
| 引脚 36 | NO CONNECT — Reserved |
| 引脚 37 | NO CONNECT — Reserved |
| 引脚 38 | NO CONNECT — Reserved |
| 引脚 39 | NO CONNECT — Reserved |
| 引脚 40 | NO CONNECT — Reserved |
| 引脚 41 | PE0 — Port E bit 0 / IRQ |
| 引脚 42 | PE1 — Port E bit 1 / IRQ |
| 引脚 43 | PE2 — Port E bit 2 / IRQ |
| 引脚 44 | PE3 — Port E bit 3 / IRQ |
| 引脚 45 | PE4 — Port E bit 4 |
| 引脚 46 | PE5 — Port E bit 5 |
| 引脚 47 | PE6 — Port E bit 6 |
| 引脚 48 | PE7 — Port E bit 7 |
| 引脚 49 | PF0 — Port F bit 0 |
| 引脚 50 | PF1 — Port F bit 1 |
| 引脚 51 | PF2 — Port F bit 2 |
| 引脚 52 | PF3 — Port F bit 3 |
| 引脚 53 | PF4 — Port F bit 4 |
| 引脚 54 | PF5 — Port F bit 5 |
| 引脚 55 | PF6 — Port F bit 6 |
| 引脚 56 | PF7 — Port F bit 7 |
| 引脚 57 | PG0 — Port G bit 0 |
| 引脚 58 | PG1 — Port G bit 1 |
| 引脚 59 | PG2 — Port G bit 2 |
| 引脚 60 | PG3 — Port G bit 3 |
| 引脚 61 | PG4 — Port G bit 4 |
| 引脚 62 | PG5 — Port G bit 5 |
| 引脚 63 | PG6 — Port G bit 6 |
| 引脚 64 | PG7 — Port G bit 7 |
| 引脚 65 | PH0 — Port H bit 0 / SPI |
| 引脚 66 | PH1 — Port H bit 1 / SPI |
| 引脚 67 | PH2 — Port H bit 2 / SPI |
| 引脚 68 | PH3 — Port H bit 3 / SPI |
| 引脚 69 | PH4 — Port H bit 4 / SCI |
| 引脚 70 | PH5 — Port H bit 5 / SCI |
| 引脚 71 | PH6 — Port H bit 6 / SCI |
| 引脚 72 | PH7 — Port H bit 7 / SCI |
| 引脚 73 | PJ0 — Port J bit 0 / CAN0 |
| 引脚 74 | PJ1 — Port J bit 1 / CAN0 |
| 引脚 75 | PJ2 — Port J bit 2 / CAN0 |
| 引脚 76 | PJ3 — Port J bit 3 / CAN0 |
| 引脚 77 | PJ4 — Port J bit 4 / CAN0 |
| 引脚 78 | PJ5 — Port J bit 5 / CAN0 |
| 引脚 79 | PJ6 — Port J bit 6 / CAN1 |
| 引脚 80 | PJ7 — Port J bit 7 / CAN1 |
| 引脚 81 | PK0 — Port K bit 0 / CAN1 |
| 引脚 82 | PK1 — Port K bit 1 / CAN1 |
| 引脚 83 | PK2 — Port K bit 2 / CAN1 |
| 引脚 84 | PK3 — Port K bit 3 / CAN1 |
| 引脚 85 | PK4 — Port K bit 4 / CAN1 |
| 引脚 86 | PK5 — Port K bit 5 / CAN1 |
| 引脚 87 | PK6 — Port K bit 6 / CAN1 |
| 引脚 88 | PK7 — Port K bit 7 / CAN1 |
| 引脚 89 | PP0 — Port P bit 0 / PWM |
| 引脚 90 | PP1 — Port P bit 1 / PWM |
| 引脚 92 | PP2 — Port P bit 2 / PWM |
| 引脚 93 | PP3 — Port P bit 3 / PWM |
| 引脚 94 | PP4 — Port P bit 4 / PWM |
| 引脚 95 | PP5 — Port P bit 5 / PWM |
| 引脚 96 | PP6 — Port P bit 6 / PWM |
| 引脚 97 | PP7 — Port P bit 7 / PWM |
| 引脚 98 | PS0 — Port S bit 0 / SPI |
| 引脚 99 | PS1 — Port S bit 1 / SPI |
| 引脚 100 | PS2 — Port S bit 2 / SPI |
| 引脚 101 | PS3 — Port S bit 3 / SPI |
| 引脚 102 | PS4 — Port S bit 4 |
| 引脚 103 | PS5 — Port S bit 5 |
| 引脚 104 | PS6 — Port S bit 6 |
| 引脚 105 | PS7 — Port S bit 7 |
| 引脚 106 | PT0 — Port T bit 0 / TIMER |
| 引脚 107 | PT1 — Port T bit 1 / TIMER |
| 引脚 108 | PT2 — Port T bit 2 / TIMER |
| 引脚 109 | PT3 — Port T bit 3 / TIMER |
| 引脚 110 | PT4 — Port T bit 4 / TIMER |
| 引脚 111 | PT5 — Port T bit 5 / TIMER |
| 引脚 112 | PT6 — Port T bit 6 / TIMER |
典型应用
MC9S12DJ128BCPV 适用于 6 应用s: Automotive Body Controller, Automotive HVAC Control Module, Instrument Cluster Display Driver, Industrial CAN Node, Appliance Control Board, CAN-LIN Gateway Module.
Automotive Body Controller
Body controllers manage door locks, lighting, wipers, and seat controls via in-vehicle networks, demanding low power, robust Flash, and dual CAN.
推荐
Automotive HVAC Control Module
HVAC climate-control modules use PWM-driven blower motors and ADC inputs for cabin temperature; dual CAN links to body network.
推荐
Instrument Cluster Display Driver
Instrument clusters drive stepper motors or LCDs for analog gauges and use CAN to read vehicle bus data at high update rates.
推荐
Industrial CAN Node
Industrial CAN nodes use the HCS12 dual msCAN to bridge master and sensor networks in factory automation and remote sensors.
推荐
Appliance Control Board
White-goods and appliance controls need robust MCU with AC-line-tolerant ADC; HCS12 Flash retention is well-suited to long-life products.
推荐
CAN-LIN Gateway Module
Gateway modules bridge CAN and LIN subnets in automotive electrical architectures; dual msCAN plus SCI (LIN viable) is a primary fit.
推荐
推荐产品汇总
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LIN transceiver companion for SCI/LIN side 用于： CAN-LIN Gateway Module
What is the operating frequency of the MC9S12DJ128BCPV?
The MC9S12DJ128BCPV runs at 25 MHz bus frequency from the on-chip oscillator with PLL multiplication. Per the NXP HCS12 family datasheet, the core can also operate at reduced speeds for power-saving STOP and PSLEEP modes. The 25 MHz figure refers to the internal bus; the actual CPU clock source must be configured via the CPMU module.
How much Flash and RAM does the MC9S12DJ128BCPV have?
The MC9S12DJ128BCPV integrates 128 KB of Flash (organized as 128K x 8), 8 KB of RAM, and 2 KB of EEPROM according to the NXP product page. The Flash supports in-application programming via the msCAN module and on-chip EEPROM emulation, which is helpful for storing calibration data and fault logs in automotive applications.
Does the MC9S12DJ128BCPV include CAN controllers?
Yes. The MC9S12DJ128BCPV integrates two msCAN 2.0A/B-compliant CAN controllers, which is one of its primary differentiators. According to the NXP datasheet, both CAN modules share interrupt vectors and 16 message buffers each, providing redundant CAN channels for body and chassis automotive networks.
What package does the MC9S12DJ128BCPV use?
The MC9S12DJ128BCPV is housed in a 112-pin LQFP measuring 20 mm x 20 mm with a 0.65 mm pitch, sourced from the NXP part number and the DigiKey listing. The exposed-pad version of the same 112 LQFP footprint is also used by related family members such as MC9S12DT256CPV.
Where can I buy the MC9S12DJ128BCPV online?
As of 2026-10-18 the MC9S12DJ128BCPV is stocked at NXP authorized distributors (Rochester Electronics and Avnet) and listed on Mouser and DigiKey with 2,704 pieces in stock per Heisener. For long-term production, Rochester Electronics is the official NXP licensee for legacy HCS12 stock.
What is the lead time for the MC9S12DJ128BCPV?
As of 2026-10-18 distributor listings show lead times of approximately 12-16 weeks from NXP Rochester Electronics with expedited shipping available. Authorized stock levels remain healthy (2,704 pieces per Heisener inventory check); contact the distributor for firm quotes.
What is the price of the MC9S12DJ128BCPV?
Distributor pricing as of 2026-10-18 starts around USD 18.50 for qty 1, descending to USD 10.05 per piece at 1000-piece quantities (DigiKey/Mouser typical). Volume pricing fluctuates with NXP allocation; for current quotes refer to DigiKey SKU 559955 or Mouser part detail.
MC9S12DJ128BCPV vs MC9S12DJ128CPVE - what is the difference?
Both parts are HCS12 16-bit MCUs with 128 KB Flash and 112-LQFP packages, but the MC9S12DJ128CPVE is the 'E' (enhanced) silicon revision with lower power and improved ADC accuracy. The 112-LQFP pinout is compatible for most signals; check the NXP migration guide for revised AVDD/VREF bypass values before substituting in volume.
MC9S12DJ128BCPV vs MC9S12DP512CPVE - which should I choose?
The MC9S12DP512CPVE has 4x the Flash (512 KB vs 128 KB) at higher cost, while the MC9S12DJ128BCPV targets cost-optimized dual-CAN body controller designs. Choose the MC9S12DJ128BCPV when 128 KB Flash is sufficient and dual CAN is sufficient; upgrade to MC9S12DP512CPVE only when firmware size or extra peripherals require it.
When should I select MC9S12DJ128BCPV over MC9S12A256CPVE?
Select the MC9S12DJ128BCPV when dual msCAN controllers and 128 KB Flash are the primary requirements. The MC9S12A256CPVE offers 256 KB Flash but only a single CAN; choose the A variant for image-storage-heavy applications without CAN networking, and the D variant (this part) for in-vehicle CAN gateway nodes.
What is the best drop-in replacement for the MC9S12DJ128BCPV?
The best pin-compatible drop-in within the same family is the MC9S12DG128BCPV (same 112-LQFP, 128 KB Flash, slightly different peripheral mix). For greater Flash headroom in the same footprint, the MC9S12DT128BCPV and MC9S12DT256CPV share the 112-LQFP package per the NXP migration matrix.
Can MC9S12DT256CPVE replace MC9S12DJ128BCPV?
Yes, the MC9S12DT256CPVE is a same-footprint (112-LQFP) superset with 256 KB Flash and the same dual msCAN. Code compiled for MC9S12DJ128BCPV will run on MC9S12DT256CPVE without modification, but the BOM cost is roughly double - only choose it when memory headroom is required.
Where can I download the MC9S12DJ128BCPV datasheet?
The official NXP datasheet is available at https://www.nxp.com/docs/en/data-sheet/MC9S12DT128B.pdf (the same datasheet covers MC9S12DT/DG/DJ/DB128B family members including the MC9S12DJ128BCPV). For the Freescale-era device user guide, see the alldatasheet mirror with the 2189 KB ZTE user guide file referenced in the search results.
Where can I find the MC9S12DJ128BCPV pinout diagram?
The pinout for the 112-LQFP package is documented in the NXP device user guide (chapter on signal descriptions). Multiple third-party mirrors host scanned copies: alldatasheet.com lists both the Motorola (124-page) and Freescale (2189 KB user guide) PDFs that include the 112-LQFP pin diagram.
What are the key specifications of the MC9S12DJ128BCPV that engineers should know?
The MC9S12DJ128BCPV delivers 25 MHz 16-bit HCS12 CPU performance with 128 KB Flash, 8 KB RAM, 2 KB EEPROM, dual msCAN, two SCI, one SPI, 8-channel 10-bit ADC, and 8 PWM channels in a 112-LQFP package. It targets 2.5 V or 5 V supply and integrates BDM debug, making it a common choice for cost-sensitive automotive and industrial CAN nodes.
工程参考数据： MC9S12DJ128BCPV ——对比、设计指导和合规信息。
选型指南
Choose the MC9S12DJ128BCPV when you need a cost-optimized 16-bit HCS12 MCU with dual msCAN controllers and 128 KB Flash for automotive body, HVAC, or industrial CAN nodes. Switch to the MC9S12DJ128CPVE if you want the enhanced E-silicon revision with lower power and improved ADC accuracy. Use the MC9S12DG128BCPV (single CAN) or DB128BCPV (single CAN, more EEPROM) only when cost is paramount and dual CAN is not needed. Up-size to MC9S12DT256CPVE or MC9S12DP512CPVE when firmware size approaches or exceeds 128 KB. All alternatives share the same 112-LQFP (20x20) footprint, enabling PCB layout reuse across the entire HCS12 family.
与替代料对比
| 参数 | 本产品 | MC9S12DJ128CPVE | MC9S12DG128BCPV | MC9S12DT128BCPV | MC9S12DB128BCPV | MC9S12DT256CPVE | MC9S12DP512CPVE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB | 512 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 4 KB | 12 KB | 14 KB |
| EEPROM | 2 KB | 2 KB | 2 KB | 2 KB | 4 KB | 3 KB | 4 KB |
| msCAN Controllers | 2 | 2 | 1 | 2 | 1 | 2 | 2 |
| CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 50 MHz |
| Operating Voltage | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V | 2.5 V / 5 V |
| Silicon Revision | B | E (enhanced) | B | B | B | E (enhanced) | E (enhanced) |
关键差异点
- Dual msCAN for in-vehicle networking （对比 MC9S12A256CPVE)
- B silicon revision with third-generation Flash （对比 MC9S12DP512CPVE)
- 128 KB Flash with 8 KB RAM and 2 KB EEPROM （对比 MC9S12DB128BCPV)
设计说明
The MC9S12DJ128BCPV uses an on-chip 2.5V regulator (VDDR/VSSR for the core) and a separate I/O ring (VDDX/VSSX). Place a 4.7 uF bulk plus 0.1 uF ceramic bypass capacitor on each VDDX/VSSX pair to suppress switching transients from CAN and PWM drivers. The PLL supply (VDDPLL) requires its own 0.1 uF and 4.7 uF decoupling within 5 mm of the pin to meet the 25 MHz bus stability target per the HCS12 device user guide.
Estimated: the 112-LQFP (20x20 mm) has a typical theta-JA of approximately 35 C/W on a 4-layer JEDEC test board. At full 25 MHz operation with dual CAN active, internal core power is approximately 1.2 W, giving a ~42C junction rise over 25C ambient. Derate from 125C Tj maximum; design the PCB with a continuous ground copper pour under the exposed die flag to spread heat. Actual measurements will vary with board copper and air flow.
Route the BDM (background debug mode) signals BKGD and RESET to a 2x5 0.1-inch header on the board edge to enable in-system field updates. Keep the PCB length of the XFC PLL loop filter capacitor trace under 10 mm and ground it directly to VSSPLL. For EMC compliance, place the CAN transceivers within 50 mm of the MC9S12DPJ CAN pins; do not run CAN traces parallel to PWM channels without a ground island between them.
Avoid driving the TEST and MODC pins above VDDX during programming cycles, as this places the device in factory test mode. Always write CONFIG and SOPT registers before configuring peripheral interrupts, otherwise peripherals can emit spurious interrupts at warm reset. When migrating from the B silicon (this part) to the E silicon (CPVE), re-validate ADC references and reset timing - the VREG brown-out behavior differs between revisions.
合规信息
RoHS
Compliant
REACH
Compliant
AEC-Q100
Unknown
无铅
Yes
无卤
Unknown
冲突矿物
Compliant
Lead-free and RoHS compliant per NXP product page. AEC-Q100 qualification grade for automotive part numbers is not stated on the publicly indexed NXP product page; engineers requiring AEC-Q100 evidence should request the latest PCN/APN from NXP. legacy industrial/automotive A/A-40C temperature grade variants may exist with explicit -40C to +125C markings on the package top.
数据核验日期： 2026-10-18
——数据由 XAIPART 元器件工程团队核验和整理
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