MC9S12DT256CMPV vs MC9S12E256MPVE 对比

详细并排对比 MC9S12DT256CMPV 出自 NXP Semiconductors 和 MC9S12E256MPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256CMPV MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV ✓ 量产中
NXP Semiconductors
MC9S12E256MPVE MC9S12E256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP

MC9S12E256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP

MC9S12E256MPVE Obsolete

规格对比

参数 MC9S12DT256CMPV MC9S12E256MPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $11.50 $18.20
Core Architecture HCS12 (S12) 16-bit CISC —
Bus Frequency Up to 50 MHz —
Program Flash 256 KB —
RAM 12 KB 16 KB
EEPROM 4 KB —
封装 LQFP-112 112-LQFP (20x20 mm)
引脚数量 112 112
Operating Voltage 5.0 V (4.5 V to 5.5 V) —
Temperature Grade Automotive (-40C to +125C) —
ADC 2 x 8-channel 10-bit 8-channel, 10-bit
PWM Channels 8 channels 6
Enhanced Capture Timer 8-channel (ECT) —
SCI (UART) Interfaces 2 —
SPI Interfaces 2 —
CAN Modules 1 x msCAN (CAN 2.0A/B) —
GPIO (Approx.) 20 discrete digital I/O lines —
Debug Interface Background Debug Mode (BDM) —
安装类型 Surface Mount (LQFP, gull-wing) Surface Mount
RoHS 状态 Compliant (per NXP product page) —
Core — HCS12
Core Size — 16-bit
Maximum CPU Speed — 25 MHz
Program Memory — 256 KB Flash
电源电压 — 5 V single rail (Vreg internal)
SCI Modules — 3 (asynchronous serial)
SPI Modules — 1
IIC Modules — 1 (Inter-IC Bus)
Timer Modules — 3 x 16-bit, 4-channel
Connectivity — EBI/EMI, I2C, SPI, SCI
工作温度 — [DATA_NEEDED: operating temperature range]
RoHS — [DATA_NEEDED: RoHS status]

数据手册与资源

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