MC9S12DT256CMPV vs MC9S12E256MPVE 비교

다음의 상세 나란히 비교: MC9S12DT256CMPV 제조: NXP Semiconductors 및 MC9S12E256MPVE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DT256CMPV MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV ✓ 활성
NXP Semiconductors
MC9S12E256MPVE MC9S12E256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP

MC9S12E256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP

MC9S12E256MPVE Obsolete

사양 비교

파라미터 MC9S12DT256CMPV MC9S12E256MPVE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 활성 Obsolete
재고 상태 In Stock In Stock
단가 (USD) $11.50 $18.20
Core Architecture HCS12 (S12) 16-bit CISC —
Bus Frequency Up to 50 MHz —
Program Flash 256 KB —
RAM 12 KB 16 KB
EEPROM 4 KB —
패키지 LQFP-112 112-LQFP (20x20 mm)
핀 수 112 112
Operating Voltage 5.0 V (4.5 V to 5.5 V) —
Temperature Grade Automotive (-40C to +125C) —
ADC 2 x 8-channel 10-bit 8-channel, 10-bit
PWM Channels 8 channels 6
Enhanced Capture Timer 8-channel (ECT) —
SCI (UART) Interfaces 2 —
SPI Interfaces 2 —
CAN Modules 1 x msCAN (CAN 2.0A/B) —
GPIO (Approx.) 20 discrete digital I/O lines —
Debug Interface Background Debug Mode (BDM) —
실장 유형 Surface Mount (LQFP, gull-wing) Surface Mount
RoHS 상태 Compliant (per NXP product page) —
Core — HCS12
Core Size — 16-bit
Maximum CPU Speed — 25 MHz
Program Memory — 256 KB Flash
공급 전압 — 5 V single rail (Vreg internal)
SCI Modules — 3 (asynchronous serial)
SPI Modules — 1
IIC Modules — 1 (Inter-IC Bus)
Timer Modules — 3 x 16-bit, 4-channel
Connectivity — EBI/EMI, I2C, SPI, SCI
동작 온도 — [DATA_NEEDED: operating temperature range]
RoHS — [DATA_NEEDED: RoHS status]

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