MC9S12DT256MPVE vs MC9S12DT256CPVE 对比

详细并排对比 MC9S12DT256MPVE 出自 NXP Semiconductors 和 MC9S12DT256CPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

规格对比

参数 MC9S12DT256MPVE MC9S12DT256CPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $14.36 $20.85
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 256 KB —
RAM 12 KB —
EEPROM 4 KB —
数据总线宽度 16-bit 16-bit
电源电压 2.35 V to 2.75 V (regulated core) 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 2x 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
封装 112-LQFP (20x20 mm) 112-pin LQFP (20x20 mm)
安装类型 Surface Mount Surface Mount
工作温度 -40C to +125C (automotive grade) -40C to +85C (industrial, per 'P' suffix family)
Debug Interface Background Debug Mode (BDM) + JTAG BDM (Background Debug Mode)
RoHS 状态 Compliant [DATA_NEEDED: RoHS status from manufacturer]
生命周期状态 NRND (Not Recommended for New Designs) —
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
最大时钟频率 — 25 MHz
Program Memory Size — 256 KB (256K x 8) Flash
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Pins — 91
PWM Channels — 8 channels
Connectivity — CAN, I2C, SCI (UART), SPI
Watchdog — COP (Computer Operating Properly) watchdog

数据手册与资源

浏览全部产品 创建 BOM 获取报价