MC9S12DT256MPVE vs MC9S12DT256CPVE 비교

다음의 상세 나란히 비교: MC9S12DT256MPVE 제조: NXP Semiconductors 및 MC9S12DT256CPVE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DT256CPVE MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE - 16-bit HCS12 MCU 256KB Flash | NXP LQFP-112

MC9S12DT256CPVE Nrnd

사양 비교

파라미터 MC9S12DT256MPVE MC9S12DT256CPVE
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND NRND
재고 상태 In Stock In Stock
단가 (USD) $14.36 $20.85
Core HCS12 (16-bit CISC) —
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 256 KB —
RAM 12 KB —
EEPROM 4 KB —
데이터 버스 폭 16-bit 16-bit
공급 전압 2.35 V to 2.75 V (regulated core) 2.35 V to 2.75 V (core), 5 V I/O tolerant typical
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 2x 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) 8-channel Enhanced Capture Timer (ECT)
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
패키지 112-LQFP (20x20 mm) 112-pin LQFP (20x20 mm)
실장 유형 Surface Mount Surface Mount
동작 온도 -40C to +125C (automotive grade) -40C to +85C (industrial, per 'P' suffix family)
Debug Interface Background Debug Mode (BDM) + JTAG BDM (Background Debug Mode)
RoHS 상태 Compliant [DATA_NEEDED: RoHS status from manufacturer]
수명 주기 상태 NRND (Not Recommended for New Designs) —
Core Processor — HCS12 (CPU12 CISC)
Core Size — 16-bit
최대 클록 주파수 — 25 MHz
Program Memory Size — 256 KB (256K x 8) Flash
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Pins — 91
PWM Channels — 8 channels
Connectivity — CAN, I2C, SCI (UART), SPI
Watchdog — COP (Computer Operating Properly) watchdog

데이터시트 & 자료

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