MC9S12DT256MPVE vs MC9S12DT256VPVE 对比

详细并排对比 MC9S12DT256MPVE 出自 NXP Semiconductors 和 MC9S12DT256VPVE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256MPVE MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256MPVE Nrnd
NXP Semiconductors
MC9S12DT256VPVE MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256VPVE Nrnd

规格对比

参数 MC9S12DT256MPVE MC9S12DT256VPVE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $14.36 $25.87
Core HCS12 (16-bit CISC) HCS12 (16-bit CISC)
Maximum CPU Frequency 25 MHz —
Program Memory (Flash) 256 KB 256 KB
RAM 12 KB 12 KB
EEPROM 4 KB 4 KB
数据总线宽度 16-bit —
电源电压 2.35 V to 2.75 V (regulated core) —
I/O Pins 91 —
ADC 2 x 10-bit, 8 channels each (16 channels total) 2 x 8-channel, 10-bit
Timers 8-channel Enhanced Capture Timer (ECT) —
Communication Interfaces 2 x SCI (UART), 2 x SPI, 1 x I2C, 1 x CAN (MSCAN 2.0A/B) —
封装 112-LQFP (20x20 mm) 112-LQFP (20x20 mm)
安装类型 Surface Mount Surface Mount
工作温度 -40C to +125C (automotive grade) —
Debug Interface Background Debug Mode (BDM) + JTAG Single-wire BDM (Background Debug Mode)
RoHS 状态 Compliant Compliant (verify per lot)
生命周期状态 NRND (Not Recommended for New Designs) —
Maximum Bus Frequency — 25 MHz
Operating Voltage — 2.5 V core / 5.0 V I/O (typical)
PWM Channels — 8
Enhanced Capture Timer Channels — 8
SCI (UART) Interfaces — 2 (asynchronous)
GPIO / Digital I/O Lines — 20 discrete digital I/O lines
Temperature Grade — Industrial
MSL 等级 — [DATA_NEEDED: MSL Level]
Lead-Free — Yes

数据手册与资源

浏览全部产品 创建 BOM 获取报价