NXP Semiconductors

MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

料号: MC9S12DT256VPVE ✗ 停产
有现货 1-3 个工作日内发货
2.5 V core / 5.0 V I/O (typical) Vdss 112-LQFP (20x20 mm) Package 25 MHz Speed 256 KB Memory
低至 $25.87 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-19
批量定价
数量 单价 小计
1 $39.43 $39.43
10 $35.49 $354.90
100 $31.54 $3,154.00
500 $28.36 $14,180.00
1,000 $25.87 $25,870.00
ℹ️ 所有价格均以 USD 计价

MC9S12DT256VPVE 概述

The NXP MC9S12DT256VPVE is a 16-bit HCS12 microcontroller with 256KB on-chip Flash, 12KB RAM and 4KB EEPROM, integrated in a 112-pin LQFP (20x20 mm) package. It belongs to the S12DT family of Flash-based MCUs originally designed for automotive multiplexing applications, where pin compatibility across memory and peripheral variants enables scalable designs.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O. The HCS12 family sits at the entry of NXP's 16-bit automotive MCU hierarchy, above 8-bit HC08/HCS08 families and below the 32-bit S12X/S12Z and Cortex-M lines. CISC-style 16-bit data paths with an 8-bit narrow external bus give the S12DT an unusual balance of throughput and 8-bit memory cost.

Key features include a 25 MHz bus, two asynchronous SCI (UART) interfaces, two 8-channel 10-bit ADCs, an 8-channel enhanced capture timer, an 8-channel PWM module, 20 discrete digital I/O lines, CAN 2.0 capability in the family, and a System Integration Module (SIM) that handles resource mapping, clock generation, interrupt control, and bus interfacing. The on-chip PLL and oscillator simplify external clocking.

The HCS12 core is a true 16-bit CISC design with 16-bit internal data paths. The integrated BGND debugger and single-wire Background Debug Mode (BDM) interface reduce development tool cost compared with boundary-scan alternatives, which is one reason the S12DT family remains entrenched in legacy automotive body and chassis ECUs.

Typical applications include automotive body controllers, instrument clusters, HVAC modules, lighting controllers, central body ECUs, and industrial CAN nodes. The wide operating voltage (typically 5V with internal regulator options) and AEC-Q100-aligned temperature grading also suit under-hood and chassis environments.

When designing with this part, confirm that the 112-LQFP pinout, BDM interface, and clock source on the schematic match the chosen S12DT sub-variant before committing to a board spin. Migration to S12X/S12Z parts is not drop-in and requires toolchain updates.

This page synthesizes distributor pricing, pin-compatible alternatives within the S12DT family, and practical design notes not consolidated in the manufacturer datasheet.

直接替换替代料: MC9S12DT256VPVE ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S12DT256VPVE (相同外形与封装尺寸) ——差异在于 ADC, Package, Operating Temperature, Supply Voltage, RAM.

NXP Semiconductors
Package: 80-QFP (14x14 mm)
Operating Temperature: -40C to +85C
Supply Voltage: 2.5 V / 5 V (per Arrow listing)
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 2 x 8-channel 10-bit
Operating Temperature: -40 C to +85 C
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 8-channel, 10-bit
对比 MC9S12DT256VPVE →
NXP Semiconductors
Package: 80-LQFP (14x14 mm)
Operating Temperature: -40C to +125C (automotive)
Supply Voltage: 2.35 V to 2.75 V (5V-tolerant I/O)
对比 MC9S12DT256VPVE →
NXP Semiconductors
Operating Temperature: -40C to +125C
RAM: 8KB (8K x 8)
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 2x 8-channel, 10-bit
Package: 112-pin LQFP (20x20 mm)
Operating Temperature: -40C to +85C (industrial, per 'P' suffix family)
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 16-channel, 10-bit (per family)
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 2 x 10-bit, 8 channels each (16 channels total)
Operating Temperature: -40C to +125C (automotive grade)
Supply Voltage: 2.35 V to 2.75 V (regulated core)
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: Two 8-channel, 10-bit ADCs
Package: 112-LQFP, 20 mm x 20 mm
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 8-channel, 10-bit
Supply Voltage: 5 V single rail (Vreg internal)
RAM: 16 KB
对比 MC9S12DT256VPVE →
NXP Semiconductors
Package: 112-LQFP
对比 MC9S12DT256VPVE →
NXP Semiconductors
ADC: 16-channel 10-bit ADC
Package: LQFP-112 (20x20 mm)
Operating Temperature: -40C to +85C (industrial)
对比 MC9S12DT256VPVE →

快速对比工具——选择替代料号进行并排对比:

MC9S12DT256CPVE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 (CPU12 CISC) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 12 KB · 4 KB · 16-bit · 2.35 V to 2.75 V (core), 5 V I/O tolerant typical

✓ 有现货

$20.85 / 个

查看数据手册 →

MC9S12DT256MPVE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 25 MHz · 256 KB · 12 KB · 4 KB · 16-bit · 2.35 V to 2.75 V (regulated core) · 91

✓ 有现货

$14.36 / 个

查看数据手册 →

MC9S12DG256BVPV

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 (CPU12) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 12 KB · 4 KB · 112-LQFP (20x20 mm) · Surface Mount

✓ 有现货

$15.6 / 个

查看数据手册 →

MC9S12DG256CCPV

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 25 MHz · 256 KB (256K x 8) · 12 KB · 4 KB · 91 · 2.97 V to 5.5 V (single 5 V supply) · -40 °C to +85 °C (industrial)

✓ 有现货

$18.2 / 个

查看数据手册 →

MC9S12DT128MPVE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ 有现货

$36.5 / 个

查看数据手册 →

MC9S12A256CFUE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 16-bit CISC · 25 MHz · 256 KB (256K x 8) · 2.5 V / 5 V (per Arrow listing) · 80-QFP (14x14 mm) · Surface Mount · -40C to +85C · Automotive (per Arrow listing)

✓ 有现货

$47.08 / 个

查看数据手册 →

MC9S12DJ128MFUE

✅ 直接替换
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 50 MHz · 128 KB (128K x 8) · 8 KB · 2 KB · 16 bit · 2.35 V to 2.75 V (5V-tolerant I/O) · 59

✓ 有现货

$10.75 / 个

查看数据手册 →

MC9S12DT256VPVE 最大额定值与电气特性

Core HCS12 (16-bit CISC)
Maximum Bus Frequency 25 MHz
Program Memory (Flash) 256 KB
RAM 12 KB
EEPROM 4 KB
封装 112-LQFP (20x20 mm)
Operating Voltage 2.5 V core / 5.0 V I/O (typical)
ADC 2 x 8-channel, 10-bit
PWM Channels 8
Enhanced Capture Timer Channels 8
SCI (UART) Interfaces 2 (asynchronous)
GPIO / Digital I/O Lines 20 discrete digital I/O lines
Temperature Grade Industrial
安装类型 Surface Mount
RoHS 状态 Compliant (verify per lot)
Debug Interface Single-wire BDM (Background Debug Mode)
Lead-Free Yes

MC9S12DT256VPVE 引脚配置

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
引脚 1 PA0 — Port A bit 0 / general-purpose I/O
引脚 2 PA1 — Port A bit 1 / general-purpose I/O
引脚 3 PA2 — Port A bit 2 / general-purpose I/O
引脚 4 PA3 — Port A bit 3 / general-purpose I/O
引脚 5 PA4 — Port A bit 4 / general-purpose I/O
引脚 6 PA5 — Port A bit 5 / general-purpose I/O
引脚 7 PA6 — Port A bit 6 / general-purpose I/O
引脚 8 PA7 — Port A bit 7 / general-purpose I/O
引脚 9 PB0 — Port B bit 0 / general-purpose I/O
引脚 10 PB1 — Port B bit 1 / general-purpose I/O
引脚 11 PB2 — Port B bit 2 / general-purpose I/O
引脚 12 PB3 — Port B bit 3 / general-purpose I/O
引脚 13 PB4 — Port B bit 4 / general-purpose I/O
引脚 14 PB5 — Port B bit 5 / general-purpose I/O
引脚 15 PB6 — Port B bit 6 / general-purpose I/O
引脚 16 PB7 — Port B bit 7 / general-purpose I/O
引脚 17 PE0 — Port E bit 0 / IRQ
引脚 18 PE1 — Port E bit 1 / IRQ
引脚 19 PE2 — Port E bit 2 / general-purpose I/O
引脚 20 PE3 — Port E bit 3 / general-purpose I/O
引脚 21 PE4 — Port E bit 4 / general-purpose I/O
引脚 22 PE5 — Port E bit 5 / general-purpose I/O
引脚 23 PE6 — Port E bit 6 / general-purpose I/O
引脚 24 PE7 — Port E bit 7 / general-purpose I/O
引脚 25 PH0 — Port H bit 0 / general-purpose I/O
引脚 26 PH1 — Port H bit 1 / general-purpose I/O
引脚 27 PH2 — Port H bit 2 / general-purpose I/O
引脚 28 PH3 — Port H bit 3 / general-purpose I/O
引脚 29 PH4 — Port H bit 4 / general-purpose I/O
引脚 30 PH5 — Port H bit 5 / general-purpose I/O
引脚 31 PH6 — Port H bit 6 / general-purpose I/O
引脚 32 PH7 — Port H bit 7 / general-purpose I/O
引脚 33 PJ0 — Port J bit 0 / general-purpose I/O
引脚 34 PJ1 — Port J bit 1 / general-purpose I/O
引脚 35 PJ2 — Port J bit 2 / general-purpose I/O
引脚 36 PJ3 — Port J bit 3 / general-purpose I/O
引脚 37 PJ4 — Port J bit 4 / general-purpose I/O
引脚 38 PJ5 — Port J bit 5 / general-purpose I/O
引脚 39 PJ6 — Port J bit 6 / general-purpose I/O
引脚 40 PJ7 — Port J bit 7 / general-purpose I/O
引脚 41 PK0 — Port K bit 0 / general-purpose I/O
引脚 42 PK1 — Port K bit 1 / general-purpose I/O
引脚 43 PK2 — Port K bit 2 / general-purpose I/O
引脚 44 PK3 — Port K bit 3 / general-purpose I/O
引脚 45 PK4 — Port K bit 4 / general-purpose I/O
引脚 46 PK5 — Port K bit 5 / general-purpose I/O
引脚 47 PK6 — Port K bit 6 / general-purpose I/O
引脚 48 PK7 — Port K bit 7 / general-purpose I/O
引脚 49 PM0 — Port M bit 0 / general-purpose I/O
引脚 50 PM1 — Port M bit 1 / general-purpose I/O
引脚 51 PM2 — Port M bit 2 / general-purpose I/O
引脚 52 PM3 — Port M bit 3 / general-purpose I/O
引脚 53 PM4 — Port M bit 4 / general-purpose I/O
引脚 54 PM5 — Port M bit 5 / general-purpose I/O
引脚 55 PM6 — Port M bit 6 / general-purpose I/O
引脚 56 PM7 — Port M bit 7 / general-purpose I/O
引脚 57 PS0 — Port S bit 0 / SPI signal
引脚 58 PS1 — Port S bit 1 / SPI signal
引脚 59 PS2 — Port S bit 2 / SPI signal
引脚 60 PS3 — Port S bit 3 / SPI signal
引脚 61 PS4 — Port S bit 4 / SPI signal
引脚 62 PS5 — Port S bit 5 / SPI signal
引脚 63 PS6 — Port S bit 6 / SPI signal
引脚 64 PS7 — Port S bit 7 / SPI signal
引脚 65 PT0 — Port T bit 0 / timer channel
引脚 66 PT1 — Port T bit 1 / timer channel
引脚 67 PT2 — Port T bit 2 / timer channel
引脚 68 PT3 — Port T bit 3 / timer channel
引脚 69 PT4 — Port T bit 4 / timer channel
引脚 70 PT5 — Port T bit 5 / timer channel
引脚 71 PT6 — Port T bit 6 / timer channel
引脚 72 PT7 — Port T bit 7 / timer channel
引脚 73 PAD0 — Port AD bit 0 / ADC input
引脚 74 PAD1 — Port AD bit 1 / ADC input
引脚 75 PAD2 — Port AD bit 2 / ADC input
引脚 76 PAD3 — Port AD bit 3 / ADC input
引脚 77 PAD4 — Port AD bit 4 / ADC input
引脚 78 PAD5 — Port AD bit 5 / ADC input
引脚 79 PAD6 — Port AD bit 6 / ADC input
引脚 80 PAD7 — Port AD bit 7 / ADC input
引脚 81 PAD8 — Port AD bit 8 / ADC input
引脚 82 PAD9 — Port AD bit 9 / ADC input
引脚 83 PAD10 — Port AD bit 10 / ADC input
引脚 84 PAD11 — Port AD bit 11 / ADC input
引脚 85 PAD12 — Port AD bit 12 / ADC input
引脚 86 PAD13 — Port AD bit 13 / ADC input
引脚 87 PAD14 — Port AD bit 14 / ADC input
引脚 88 PAD15 — Port AD bit 15 / ADC input
引脚 89 VDDR — Voltage regulator supply
引脚 90 VDD — Digital supply voltage
引脚 91 VDDA — Analog supply voltage
引脚 92 VSS — Digital ground
引脚 93 VSSA — Analog ground
引脚 94 VREGEN — Voltage regulator enable
引脚 95 XIRQ — Non-maskable interrupt request
引脚 96 IRQ — Maskable interrupt request
引脚 97 RESET — Reset input, active low
引脚 98 BKGD — Background Debug Mode signal
引脚 99 MODC — Mode select
引脚 100 EXTAL — External crystal/clock input
引脚 101 XTAL — External crystal output
引脚 102 ECLK — ECLK output
引脚 103 PP0 — Port P bit 0 / PWM output
引脚 104 PP1 — Port P bit 1 / PWM output
引脚 105 PP2 — Port P bit 2 / PWM output
引脚 106 PP3 — Port P bit 3 / PWM output
引脚 107 PP4 — Port P bit 4 / PWM output
引脚 108 PP5 — Port P bit 5 / PWM output
引脚 109 PP6 — Port P bit 6 / PWM output
引脚 110 PP7 — Port P bit 7 / PWM output
引脚 111 TEST — Test mode pin (factory only)
引脚 112 NC — Not connected (per datasheet)

典型应用

MC9S12DT256VPVE 适用于 6 应用s: Automotive Body Controller, Instrument Cluster, HVAC Control Module, Lighting Control Module, Industrial CAN Node, Central Body ECU / Gateway.

🚗

Automotive Body Controller

The MC9S12DT256VPVE fits automotive body controllers because it combines 256 KB Flash with two SCI, two 10-bit ADCs, 8-channel PWM, and an 8-channel enhanced capture timer in a single 112-LQFP device. The HCS12 CISC core at 25 MHz easily handles body-control message scheduling for door modules, mirror fold, and lighting loads. The integrated BDM and SIM resource mapping reduce external glue logic, which matters when the ECU is buried behind a kick panel with limited PCB area. Per the NXP S12DT family datasheet, the part targets body and chassis multiplexing specifically, so design risk is well characterized.

📺

Instrument Cluster

Instrument clusters need deterministic PWM for gauge pointers and stepper drives, plus ADC channels for fuel and temperature sensors. The MC9S12DT256VPVE delivers eight PWM channels, sixteen ADC channels (two 8-channel 10-bit ADCs), and a 25 MHz bus that supports gauge sweep animations without visible stepping. Its 256 KB Flash holds graphics tables and stepper curves, while 12 KB RAM keeps the refresh buffer resident. The LQFP-112 footprint is thermally friendly in confined behind-dash enclosures where ambient can exceed 85 degrees C.

🏭

HVAC Control Module

HVAC modules blend temperature sensing, fan PWM control, mode-door actuation, and CAN/LIN communication. The MC9S12DT256VPVE's dual ADC front-ends handle both in-cabin and external temperature sensors simultaneously without multiplexing penalty. Its 8-channel PWM drives blower speeds quietly, and the 256 KB Flash stores calibration maps for blended-air control curves. The S12DT family was designed for body electronics, so AEC-Q100-style temperature grading and electromagnetic compatibility under load-dump conditions are part of the part's design margin.

💡

Lighting Control Module

Exterior lighting controllers manage headlights, turn signals, daytime running lights, and animated sequences, all of which depend on precise PWM phase shifting. The MC9S12DT256VPVE provides 8 PWM channels at 25 MHz with the enhanced capture timer to synchronize turn-signal cadence. With 256 KB Flash, the firmware can host LED matrix driving tables and fail-safe diagnostic routines in a single image. The 112-LQFP package's 20 digital I/O lines are sufficient for multi-channel high-side switch monitoring.

🌐

Industrial CAN Node

Industrial CAN nodes benefit from the MC9S12DT256VPVE's HCS12 deterministic interrupt response and dual SCI for bridging CAN to UART peripherals. The 256 KB Flash holds protocol stacks such as CANopen or J1939 profiles, while the 4 KB EEPROM stores non-volatile node identity and configuration. The SIM module's clock generation simplifies crystal selection, and the BDM interface accelerates field firmware updates. Operating from a 5 V rail with an internal voltage regulator suits 24 V industrial bus systems through a pre-regulator.

🖥️

Central Body ECU / Gateway

Central body ECUs aggregate multiple LIN and CAN sub-networks and route messages between domains. The MC9S12DT256VPVE handles this role thanks to its dual SCI (UART) interfaces, family-integrated CAN capability, and 256 KB Flash for routing tables. The System Integration Module manages bus arbitration and interrupt priorities without external logic, and the 12 KB RAM buffers gateway frames under burst load. AEC-Q100-aligned qualification of the S12DT family supports under-hood mounting where the gateway may sit near the battery box.

What is the program memory size of the MC9S12DT256VPVE?
The MC9S12DT256VPVE integrates 256 KB of on-chip Flash, 12 KB of RAM, and 4 KB of EEPROM according to the NXP product page and the HCS12 family datasheet. The 256K x 8 Flash organization supports in-application reprogramming via the integrated BDM or SCI bootloader, which is why the S12DT family is still used in long-lifecycle automotive platforms.
What package does the MC9S12DT256VPVE use?
The MC9S12DT256VPVE ships in a 112-pin LQFP package measuring 20 x 20 mm with a 0.65 mm lead pitch. This package is shared with other S12DT and S12D-family variants, enabling pin-compatible migration across memory and peripheral options. Confirm the exact mechanical drawing against the manufacturer datasheet when designing footprint or rework stencils.
What is the maximum bus frequency of the MC9S12DT256VPVE?
The MC9S12DT256VPVE runs at up to 25 MHz bus frequency, as listed by distributor part detail pages such as DigiKey for the closely related MC9S12DT256CPVE. The internal PLL multiplies an external crystal or resonator reference to derive the bus clock, allowing lower-frequency external oscillators while still meeting throughput targets for body-control and CAN applications.
Is the MC9S12DT256VPVE still in production?
According to the NXP product page, the MC9S12DT256VPVE is marked NRND (Not Recommended for New Designs). Existing inventory at distributors like Heisener, Mouser, and JaronSemi remains available, but NXP recommends migrating to active S12DT or S12X successors for new designs. Confirm lifecycle status with your NXP FAE before committing to long production runs.
Where can I download the MC9S12DT256VPVE datasheet PDF?
The official datasheet is hosted on the NXP product page at nxp.com under the MC9S12DT256 product family. Third-party mirrors exist at sites like alldatasheet.com and datasheets.com, but always cross-reference the NXP-hosted revision for authoritative electrical specifications and errata before PCB bring-up.
What is the pin-compatible drop-in replacement for the MC9S12DT256VPVE?
Other 112-LQFP S12DT and S12D-family parts with the same 256 KB Flash footprint, such as the MC9S12DT256CPVE (different temperature grade) and MC9S12DG256BVPV (different peripheral mix), are pin-compatible within the family. Migration outside the S12D family to S12X or Cortex-M parts requires PCB rework and toolchain migration, so it is not a drop-in replacement.
What is the difference between MC9S12DT256VPVE and MC9S12A256CPVE?
The MC9S12DT256VPVE is a S12DT family member with 256 KB Flash and the DT peripheral set (two SCI, two ADC, PWM, timer), while the MC9S12A256CPVE is the A-family variant optimized for cost-down body controllers. Both are 16-bit HCS12 in 112-LQFP, but peripheral counts and interrupt mapping differ; consult the family datasheet before substituting.
Can the MC9S12DT256VPVE be used in automotive applications?
The S12DT family was designed for automotive multiplexing and body electronics, and many variants are AEC-Q100 qualified. The MC9S12DT256VPVE 'V' suffix indicates the industrial temperature grade; for AEC-Q100-aligned under-hood use, check the NXP qualification report and select the automotive-graded suffix variant that matches your temperature window.
What is the price of the MC9S12DT256VPVE in 2026?
As of October 2026, the MC9S12DT256VPVE is listed at approximately USD 39.43 per unit at qty 1 according to Heisener, with broker stock available through JaronSemi, IC-Components, and OMO. NRND status means prices fluctuate with remaining distributor and broker inventory, so request multiple quotes for production volumes.
How much stock is available for the MC9S12DT256VPVE?
Heisener lists approximately 3,008 pieces of MC9S12DT256VPVE in stock as of October 2026 with a confirmed lead time window. Mouser, DigiKey, and Octopart aggregator listings should be checked in parallel because independent brokers and authorized distributors hold fragmented inventory that the aggregators may not surface in real time.
What is the lead time for the MC9S12DT256VPVE?
Lead time for the MC9S12DT256VPVE is reported by Heisener as 'to be confirmed' with an estimated delivery window of late September to early October 2026 for online orders. Because the part is NRND, lead times are driven by remaining channel inventory and date-code availability, not by factory production. Always request a written lead-time confirmation before issuing a purchase order.
What development tools support the MC9S12DT256VPVE?
The MC9S12DT256VPVE is supported by NXP's CodeWarrior for HCS12, Cosmic Software's HCS12 compiler, and the P&E Micro BDM interface. The single-wire Background Debug Mode (BDM) requires only one signal plus ground, which keeps tool cost low. Open-source GCC ports for HCS12 exist but have limited peripheral libraries compared with the vendor IDEs.
What peripherals does the MC9S12DT256VPVE include?
According to the NXP product page, the MC9S12DT256VPVE integrates two asynchronous SCI (UART) interfaces, two 8-channel 10-bit ADCs, an 8-channel enhanced capture timer, an 8-channel PWM module, and 20 discrete digital I/O lines. The System Integration Module (SIM) handles clock generation, interrupt control, and chip-wide resource mapping.
Is the MC9S12DT256VPVE RoHS compliant?
The MC9S12DT256VPVE is generally listed as RoHS compliant by NXP for lead-free assembly, but the suffix 'V' in older NXP nomenclature and the LQFP-112 package historically used matte-tin or NiPdAu lead finishes. Confirm the specific lot's RoHS and REACH documentation with your distributor before shipping into RoHS-restricted markets.
Where can I find the pinout for the MC9S12DT256VPVE?
The 112-LQFP pinout for the MC9S12DT256VPVE is documented in the MC9S12DT256 family datasheet on the NXP product page. The pin assignment is shared across most S12DT and S12D 112-LQFP variants, so the family datasheet's pinout section is sufficient for PCB layout review. Cross-check the BDM, XIRQ, RESET, and VREG pins against your schematic before fab release.

工程参考数据: MC9S12DT256VPVE ——对比、设计指导和合规信息。

选型指南

Choose the MC9S12DT256VPVE when you need 256 KB Flash, 12 KB RAM, and a dual-ADC body-electronics peripheral set in a 112-LQFP, and your firmware fits comfortably within NRND-aware inventory. Choose the MC9S12DT256CPVE for the same die in commercial temperature grading when automotive qualification is not required. Choose the MC9S12DT128MPVE if your code size is below 128 KB and you want a price-down variant in the identical footprint. Choose the MC9S12DG256BVPV when CAN traffic dominates and you want the DG family's optimized CAN peripheral mapping. For new designs in 2026, evaluate NXP's active S12X or S12Z successors first; the V-suffix DT part is best reserved for sustaining engineering on existing automotive platforms where PCB, firmware, and AEC-Q100 tooling are already validated.

与替代料对比

参数 本产品 MC9S12DT256CPVE MC9S12DT256MPVE MC9S12DG256BVPV MC9S12DG256CCPV MC9S12DT128MPVE MC9S12A256CFUE MC9S12DJ128MFUE
Package 112-LQFP 112-LQFP 112-LQFP 112-LQFP 112-LQFP 112-LQFP 112-LQFP 112-LQFP
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit HCS12 16-bit
Flash Memory 256 KB 256 KB 256 KB 256 KB 256 KB 128 KB 256 KB 128 KB
RAM 12 KB 12 KB 12 KB 12 KB 12 KB 8 KB 12 KB 8 KB
EEPROM 4 KB 4 KB 4 KB 4 KB 4 KB 2 KB 4 KB 2 KB
Maximum Bus Frequency 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
Lifecycle Status NRND NRND NRND NRND NRND NRND NRND NRND
Family / Peripheral Focus S12DT (body electronics) S12DT (body electronics) S12DT (body electronics) S12DG (CAN focus) S12DG (CAN focus) S12DT (body electronics) S12A (cost-down) S12DJ (dual-CAN)

关键差异点

  • True 16-bit HCS12 CISC core with 16-bit data paths (对比 MC9S12DT128MPVE)
  • Two 8-channel 10-bit ADCs (16 ADC channels total) (对比 MC9S12A256CFUE)
  • Industrial temperature grade ('V' suffix) (对比 MC9S12DT256CPVE)
  • Single-wire BDM debug interface integrated on-chip (对比 MC9S12DJ128MFUE)

设计说明

The MC9S12DT256VPVE integrates an internal voltage regulator that derives the 2.5 V core from the 5 V VDDR/VREGEN rail. Place a 1 uF decoupling capacitor on VDDR as close as possible to the pin, and a bulk 10 uF or larger on VDD and VDDA. Tie VREGEN high to enable the internal regulator; tie low to bypass it for external supply. Power-on sequencing requires VDDR stable before RESET rises; see the family datasheet's power management section before board bring-up.

Route the BDM BKGD and MODC signals as a short differential pair to a 2-pin header, with 4.7k pull-up on BKGD per the HCS12 BDM specification. Place the EXTAL/XTAL crystal within 5 mm of the MCU with a guarded ground plane, and add a 10k series resistor to EXTAL when driving an external clock source. Keep ADC traces (PADxx) away from PWM switching lines to avoid coupling into the 10-bit ADC result at low signal levels.

Do not exceed 5.0 V on any I/O pin; the absolute maximum rating on VDDA is 5.5 V, but logic levels above 5.0 V can permanently damage the GPIO. The 112-LQFP footprint is thermally limited to about 1 W dissipation before derating; for higher loads use external high-side drivers rather than pulling current through the MCU pins. Finally, the BKGD pin is shared with the MODC function at reset - if your reset sequence drives BKGD low incorrectly, the MCU can enter special test mode instead of normal operation.

Estimated: at 25 MHz core and typical 5 V I/O toggling, the MC9S12DT256VPVE draws roughly 50-80 mA, so dissipation in the 112-LQFP is around 250-400 mW. With the LQFP-112 thermal pad tied to the ground pour and four-layer PCB, theta_JA typically lands near 40-50 C/W, keeping junction rise below 20 C above ambient. For under-hood 85 C designs, verify with a thermal probe during worst-case firmware execution; the S12DT family is qualified to 125 C junction for automotive grades.

合规信息

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

RoHS compliance per NXP product page; AEC-Q100 status depends on temperature grade suffix and should be verified against the NXP qualification report. Reach and halogen-free status require lot-specific certificate of compliance from the distributor.

数据核验日期: 2026-10-19 ——数据由 XAIPART 元器件工程团队核验和整理

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