MC9S12DT256VPVE vs MC9S12DG256BVPV 对比
详细并排对比 MC9S12DT256VPVE 出自 NXP Semiconductors 和 MC9S12DG256BVPV 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256VPVE Nrnd规格对比
| 参数 | MC9S12DT256VPVE | MC9S12DG256BVPV |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $25.87 | $15.60 |
| Core | HCS12 (16-bit CISC) | — |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | — |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| 封装 | 112-LQFP (20x20 mm) | 112-LQFP (20x20 mm) |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) | — |
| ADC | 2 x 8-channel, 10-bit | 2 x 8-channel 10-bit |
| PWM Channels | 8 | 8 |
| Enhanced Capture Timer Channels | 8 | — |
| SCI (UART) Interfaces | 2 (asynchronous) | — |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines | — |
| Temperature Grade | Industrial | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | Compliant (verify per lot) | Compliant |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| MSL 等级 | [DATA_NEEDED: MSL Level] | 3 (168 hours) |
| Lead-Free | Yes | — |
| Core Processor | — | HCS12 (CPU12) |
| Core Size | — | 16-bit |
| Maximum Clock Speed | — | 25 MHz |
| Program Memory Size | — | 256 KB (256K x 8) Flash |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| 工作电源电压 | — | 2.5 V core / 5 V I/O (single 5 V supply with internal regulator) |
| 工作温度 | — | -40 C to +85 C |
| Number of I/O | — | 91 |
| Communication Interfaces | — | CAN, I2C, SCI, SPI |
| Connectivity | — | CAN 2.0 A/B, I2C, SPI, 2x SCI |
| Peripherals | — | PWM, WDT, POR, LVD, BDM debug |
| Data Converters | — | A/D 16x10b |
| Oscillator Type | — | Internal PLL + external crystal |