MC9S12DT256VPVE vs MC9S12DT256MFUE 对比

详细并排对比 MC9S12DT256VPVE 出自 NXP Semiconductors 和 MC9S12DT256MFUE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256VPVE MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256VPVE Nrnd
NXP Semiconductors
MC9S12DT256MFUE MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE - 16-Bit 25MHz 256KB Flash MCU | NXP | 80-QFP

MC9S12DT256MFUE ✓ 量产中

规格对比

参数 MC9S12DT256VPVE MC9S12DT256MFUE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $25.87 $19.20
Core HCS12 (16-bit CISC) —
Maximum Bus Frequency 25 MHz —
Program Memory (Flash) 256 KB —
RAM 12 KB [DATA_NEEDED: RAM size]
EEPROM 4 KB [DATA_NEEDED: EEPROM size]
封装 112-LQFP (20x20 mm) —
Operating Voltage 2.5 V core / 5.0 V I/O (typical) —
ADC 2 x 8-channel, 10-bit 16-channel, 10-bit (per family)
PWM Channels 8 —
Enhanced Capture Timer Channels 8 —
SCI (UART) Interfaces 2 (asynchronous) —
GPIO / Digital I/O Lines 20 discrete digital I/O lines —
Temperature Grade Industrial Automotive
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant (verify per lot) [DATA_NEEDED: RoHS status]
Debug Interface Single-wire BDM (Background Debug Mode) —
MSL 等级 [DATA_NEEDED: MSL Level] [DATA_NEEDED: MSL level]
Lead-Free Yes —
Core Architecture — HCS12 (CPU12), 16-bit CISC
Maximum CPU Frequency — 25 MHz
Flash Memory — 256 KB (256K x 8)
数据总线宽度 — 16-bit
Operating Supply Voltage (Core) — 2.35 V to 2.75 V
I/O Supply Voltage — 5V-tolerant I/O on VDDR/VSSR
Number of I/O Pins — 91
Package Type — 80-QFP (PQFP/LQFP-80, 14x14 mm)
Terminal Form — GULL WING
Number of Terminals — 80
On-chip CAN Module — MSCAN (CAN 2.0A/B)
PWM Module — 8-channel 16-bit PWM
Communication Peripherals — SCI, SPI, IIC, BDLC

数据手册与资源

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