MC9S12GC32MFAE vs MC9S12GC32VFAE 对比

详细并排对比 MC9S12GC32MFAE 出自 NXP Semiconductors 和 MC9S12GC32VFAE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12GC32MFAE MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE - 16-bit HCS12 MCU, 32KB Flash, 48-LQFP | NXP

MC9S12GC32MFAE Nrnd
NXP Semiconductors
MC9S12GC32VFAE MC9S12GC32VFAE - 16-Bit HCS12 MCU, 32KB Flash, 25MHz | NXP

MC9S12GC32VFAE - 16-Bit HCS12 MCU, 32KB Flash, 25MHz | NXP

MC9S12GC32VFAE ✓ 量产中

规格对比

参数 MC9S12GC32MFAE MC9S12GC32VFAE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $8.44 $5.64
Core HCS12 (16-bit) CPU12 (HCS12)
CPU Family S12GC —
Program Memory (Flash) 32 KB (32K x 8) 32 KB (32K x 8)
RAM 2 KB 2 KB
EEPROM 1 KB 1 KB (byte-erasable)
Maximum Bus Clock 25 MHz (50 MHz core via PLL) —
电源电压 2.97 V to 5.5 V —
Internal Voltage Regulator On-chip bandgap Vreg (2.5 V core) —
ADC 10-bit 10-bit, 10 channels
PWM / Timer Channels 8 channels —
SCI (UART) Up to 2 —
SPI 1 1 channel
GPIO Up to 60 Up to 35 (package dependent)
Debug Interface BDM (single-wire background debug) BDM (Background Debug Mode)
封装 48-LQFP (7x7 mm) 48-LQFP (7x7 mm)
工作温度 [DATA_NEEDED: operating temperature grade] -40C to +105C (automotive)
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
安装类型 Surface Mount Surface Mount
Core Architecture — 16-bit
Series — HCS12 (Goldfish / MC9S12C)
Maximum CPU Frequency — 25 MHz
CAN Module — MSCAN (CAN 2.0A/B), 8 channels
SCI / UART — 1 channel
Timers — 16-bit TIM/PWM module + 8-bit MOD timer
Supply Voltage (VDD) — 2.35 V to 2.75 V
I/O Supply (VDDR) — 2.35 V to 5.5 V
MSL 等级 — 3

数据手册与资源

浏览全部产品 创建 BOM 获取报价