MC9S12XDT256CAA vs MC9S12XDT256MAA 对比
详细并排对比 MC9S12XDT256CAA 出自 NXP Semiconductors 和 MC9S12XDT256MAA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S12XDT256CAA | MC9S12XDT256MAA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $10.83 | $0.00 |
| Core Processor | HCS12X (S12XD) | HCS12X |
| Core Size | 16-Bit | 16-Bit |
| Speed | 80 MHz | — |
| Flash Memory | 256KB (256K x 8) | — |
| Number of I/O | 59 | 59 |
| Supply Voltage (Vdd) | 2.35 V to 5.5 V (per distributor listing) | — |
| Data Converters | A/D 10-bit | — |
| 工作温度 | -40C to +85C (TA) | — |
| 封装 / 外壳 | 80-QFP (14x14 mm) | — |
| Supplier Device Package | 80-QFP (14x14) | — |
| 安装类型 | Surface Mount | Surface Mount |
| Terminal Form | Gull Wing | Gull Wing |
| Package Shape | Square (QFP) | — |
| Packaging Method | Tray | — |
| Series | HCS12X / S12XD Family (MC9S12XDT256) | — |
| Temperature Grade | Industrial | Automotive |
| Lifecycle Status (NXP) | NRND (Not Recommended for New Designs) | — |
| EEPROM Size | [DATA_NEEDED: EEPROM Size] | — |
| SRAM Size | [DATA_NEEDED: SRAM Size] | — |
| Peripherals (CAN/LIN/SPI/SCI) | [DATA_NEEDED: peripheral counts] | — |
| Core Architecture | — | CISC |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 256KB (256K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 16KB |
| 电源电压 | — | 2.5V/5V |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| 封装 | — | 80-QFP (14x14 mm) |
| Packaging | — | Tray |
| Part Status | — | NRND (Not Recommended for New Designs) |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |
| 工作温度范围 | — | [DATA_NEEDED: operating temperature range] |