MCF5307CAI66B vs MCF5307FT66B 对比

详细并排对比 MCF5307CAI66B 出自 NXP Semiconductors 和 MCF5307FT66B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCF5307CAI66B MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B - ColdFire V3 32-bit MPU 66MHz | NXP Semiconductors

MCF5307CAI66B ⚠ 最后一次采购
NXP Semiconductors
MCF5307FT66B MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B - 66MHz ColdFire V3 MCU 208-FQFP | NXP

MCF5307FT66B Nrnd

规格对比

参数 MCF5307CAI66B MCF5307FT66B
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $34.80 $16.80
Core ColdFire V3 —
数据总线宽度 32 bit 32-bit
最大时钟频率 66 MHz 66 MHz
Performance 70 MIPS —
Instruction Set Architecture ColdFire (variable-length RISC, 68k-derived) —
On-chip SRAM 4 KB 4 KB (4K x 8)
On-chip ROM ROMless —
电源电压 3.3 V [DATA_NEEDED: VDD nominal - 3.3 V typical per family datasheet]
工作温度 -40C to +85C [DATA_NEEDED: temperature grade per device marking]
封装 208-FQFP (28x28 mm) —
安装类型 Surface Mount Surface Mount
MAC Unit Yes (integrated multiply-accumulate) —
DRAM Controller Yes (integrated) —
DMA Controller Yes —
UART 2 —
Process Node 0.35 um —
Tray Quantity Per manufacturer tray standard —
RoHS 状态 Compliant [DATA_NEEDED: per device marking]
Core Architecture — ColdFire V3 (MCF530x)
Program Memory Type — ROMless (external memory required)
Number of I/O Lines — 16
Oscillator Type — External
封装 / 外壳 — 208-BFQFP (28x28 mm)
External Memory Controller — Yes (ROM/SRAM/DRAM/Flash)
DMA Channels — [DATA_NEEDED: DMA channel count]
Timers — [DATA_NEEDED: timer module count]
Serial Interfaces — [DATA_NEEDED: UART/SPI/I2C instance count]
Packaging (distributor) — Tray

数据手册与资源

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