MCIMX233CJM4C vs MCIMX233DJM4B 对比

详细并排对比 MCIMX233CJM4C 出自 NXP Semiconductors 和 MCIMX233DJM4B 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MCIMX233CJM4C MCIMX233CJM4C - i.MX233 ARM9 454MHz MPU 169-BGA | NXP

MCIMX233CJM4C - i.MX233 ARM9 454MHz MPU 169-BGA | NXP

MCIMX233CJM4C ✗ 停产
NXP Semiconductors
MCIMX233DJM4B MCIMX233DJM4B - i.MX23 ARM926EJ-S MPU, 454 MHz, 169-MAPBGA | NXP Semiconductors

MCIMX233DJM4B - i.MX23 ARM926EJ-S MPU, 454 MHz, 169-MAPBGA | NXP Semiconductors

MCIMX233DJM4B ⚠ 最后一次采购

规格对比

参数 MCIMX233CJM4C MCIMX233DJM4B
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 最后采购期
库存状态 有库存 有库存
单价(USD) $9.85 $9.85
Core Architecture ARM926EJ-S (ARMv5TEJ) ARM926EJ-S
Number of Cores 1 —
数据总线宽度 32-bit 32-bit
Maximum CPU Clock 454 MHz 454 MHz
Instruction Cache (I-Cache) 16 KB —
Data Cache (D-Cache) 16 KB —
Internal SRAM 32 KB —
ROM (Bootloader) 64 KB —
Program Memory Size 64 KB (16K x 32) —
RAM Size 32 KB (8K x 32) —
Number of I/O 95 —
工作温度范围 -40C to +85C (Industrial) -40 C to +85 C (commercial grade)
Oscillator Type External —
封装 / 外壳 169-MAPBGA (11x11 mm) —
安装类型 Surface Mount Surface Mount (BGA)
Process Technology 90 nm CMOS —
RoHS 状态 Compliant —
Core Count — 1
Instruction Cache — 16 KB
Data Cache — 16 KB
封装 — 169-MAPBGA (11x11 mm)
Ball Pitch — 0.65 mm
USB — USB HS Device/Host with integrated PHY
UART — 3
SSP (SPI) — 2
I2C — 1 master
Serial Audio Interface (SAI) — 2
SPDIF — 1 (transceiver)
Low-Resolution ADC — 6 channels, 12-bit
LCD Controller — Yes (digital TFT panels)
Integrated PMU — Yes (linear LDOs + DCDC control)
Mixed-Signal Audio / Headphone Amplifier — Yes (integrated)
电源电压 — Single 3.6 V to 4.5 V (Li-Ion cell)

数据手册与资源

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