MPC8250ACZQIHBC vs MPC8270VRMIBA 对比
详细并排对比 MPC8250ACZQIHBC 出自 NXP Semiconductors 和 MPC8270VRMIBA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
规格对比
| 参数 | MPC8250ACZQIHBC | MPC8270VRMIBA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 停产 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $99.50 | $95.75 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | PowerQUICC II (MPC82xx) |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2_LE, 32-bit |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| 数据总线宽度 | 64-Bit | — |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 工作温度 | -40C to +105C (industrial) | 0 C to 105 C |
| Package Type | TEPBGA / Plastic BGA | — |
| 引脚数量 | 516 | — |
| Package Dimensions | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Process Technology | 0.25 um CMOS | HiPerMOS7, 0.13 micron |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL 等级 | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| Core Frequency | — | 266 MHz |
| On-Chip Cache | — | 32 KB |
| Core Voltage | — | 1.45 V to 1.6 V |
| I/O Voltage | — | 3.3 V |
| 封装 | — | 516-PBGA (27 x 27 mm) |
| Integrated Peripherals | — | PCI, USB, HDLC, 10/100 Ethernet |
| Communications Module | — | CPM with multi-channel HDLC and ATM |
| PCI Interface | — | PCI 2.2 compliant |
| USB Interface | — | USB 1.1 (function or host with external PHY) |
| Ethernet MACs | — | Up to 3 x 10/100 Ethernet |
| RoHS 状态 | — | [DATA_NEEDED: RoHS status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |