MPC8250ACZQIHBC vs MPC8270VRMIBA 비교
다음의 상세 나란히 비교: MPC8250ACZQIHBC 제조: NXP Semiconductors 및 MPC8270VRMIBA 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8250ACZQIHBC - PowerQUICC II MPU 200MHz 516-PBGA | NXP
MPC8250ACZQIHBC Obsolete
사양 비교
| 파라미터 | MPC8250ACZQIHBC | MPC8270VRMIBA |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | 수명 종료 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $99.50 | $95.75 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC II | PowerQUICC II (MPC82xx) |
| Core Processor | PowerPC G2 | — |
| Core Architecture | PowerPC 603e, 32-Bit RISC | PowerPC G2_LE, 32-bit |
| Clock Speed | 200 MHz | — |
| Number of Cores | 1 (CPU) + 1 CPM | 1 |
| 데이터 버스 폭 | 64-Bit | — |
| Supply Voltage (Core) | 1.8 V | — |
| Supply Voltage (I/O) | 3.3 V | — |
| 동작 온도 | -40C to +105C (industrial) | 0 C to 105 C |
| Package Type | TEPBGA / Plastic BGA | — |
| 핀 수 | 516 | — |
| Package Dimensions | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| 실장 유형 | Surface Mount (BGA) | Surface Mount |
| Process Technology | 0.25 um CMOS | HiPerMOS7, 0.13 micron |
| Instruction Cache | 32 KB | — |
| Data Cache | 32 KB | — |
| Integrated Peripheral | PCI bridge, CPM (communications processor module) | — |
| MSL 레벨 | 3 (168 hours) | [DATA_NEEDED: MSL level] |
| Lead Free | Yes (per datasheet package code) | — |
| Core Frequency | — | 266 MHz |
| On-Chip Cache | — | 32 KB |
| Core Voltage | — | 1.45 V to 1.6 V |
| I/O Voltage | — | 3.3 V |
| 패키지 | — | 516-PBGA (27 x 27 mm) |
| Integrated Peripherals | — | PCI, USB, HDLC, 10/100 Ethernet |
| Communications Module | — | CPM with multi-channel HDLC and ATM |
| PCI Interface | — | PCI 2.2 compliant |
| USB Interface | — | USB 1.1 (function or host with external PHY) |
| Ethernet MACs | — | Up to 3 x 10/100 Ethernet |
| RoHS 상태 | — | [DATA_NEEDED: RoHS status] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |