MPC8255ACZUMHBB vs MPC8255AVVMHBB 对比
详细并排对比 MPC8255ACZUMHBB 出自 NXP Semiconductors 和 MPC8255AVVMHBB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB Obsolete规格对比
| 参数 | MPC8255ACZUMHBB | MPC8255AVVMHBB |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $97.50 | $78.80 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC II HIP4 | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2 | PowerPC G2, 32-bit |
| 数据总线宽度 | 64-Bit | — |
| Core Supply Voltage | 1.8 V | 1.8 V |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40C to +105C (extended, per 'MH' suffix) |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.18 micrometre CMOS |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | Non-compliant (NO-PB suffix - lead-bearing) |
| Core Frequency | — | 266 MHz |
| Bus Frequency | — | 133 MHz (core-to-memory bus) |
| Cache (I/D) | — | 16 Kbyte instruction / 16 Kbyte data |
| 封装 | — | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| I/O Supply Voltage | — | 3.3 V |
| Integrated Ethernet MAC | — | 2x 10/100 Mbit/s (MII/RMII) |
| PCI Interface | — | Yes (32-bit, 66 MHz capable) |
| CPM Serial Controllers | — | HDLC/SDLC, UART, I2C, SPI, SCC/SMC |
| Lifecycle | — | No Longer Manufactured (NXP) |