MPC8255ACZUMHBB vs MPC8255AVVMHBB 비교
다음의 상세 나란히 비교: MPC8255ACZUMHBB 제조: NXP Semiconductors 및 MPC8255AVVMHBB 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
NXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB Obsolete사양 비교
| 파라미터 | MPC8255ACZUMHBB | MPC8255AVVMHBB |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $97.50 | $78.80 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC II HIP4 | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2 | PowerPC G2, 32-bit |
| 데이터 버스 폭 | 64-Bit | — |
| Core Supply Voltage | 1.8 V | 1.8 V |
| Maximum Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 |
| Instruction Set | 32-Bit RISC | — |
| Core | MPC82xx | — |
| Package Type | T-BGA | — |
| Pin/Ball Count | 480 | — |
| Package Size | 37.50 x 37.50 mm | — |
| Package Height | 1.55 mm | — |
| Ball Pitch | 1.27 mm | — |
| 동작 온도 | [DATA_NEEDED: operating temperature range] | -40C to +105C (extended, per 'MH' suffix) |
| Process Technology | 0.25 micron (HiP4) silicon revision | 0.18 micrometre CMOS |
| Integrated CPM | Yes (dual communications processor modules) | — |
| Ethernet MACs | Dual 10/100 MAC | — |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| RoHS 상태 | [DATA_NEEDED: RoHS compliance status] | Non-compliant (NO-PB suffix - lead-bearing) |
| Core Frequency | — | 266 MHz |
| Bus Frequency | — | 133 MHz (core-to-memory bus) |
| Cache (I/D) | — | 16 Kbyte instruction / 16 Kbyte data |
| 패키지 | — | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| I/O Supply Voltage | — | 3.3 V |
| Integrated Ethernet MAC | — | 2x 10/100 Mbit/s (MII/RMII) |
| PCI Interface | — | Yes (32-bit, 66 MHz capable) |
| CPM Serial Controllers | — | HDLC/SDLC, UART, I2C, SPI, SCC/SMC |
| Lifecycle | — | No Longer Manufactured (NXP) |