MPC8260AZUMHBB vs MPC8260AZUPIBB 对比

详细并排对比 MPC8260AZUMHBB 出自 NXP Semiconductors 和 MPC8260AZUPIBB 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8260AZUMHBB MPC8260AZUMHBB - PowerQUICC II HIP4 266MHz MPU | NXP 480-TBGA

MPC8260AZUMHBB - PowerQUICC II HIP4 266MHz MPU | NXP 480-TBGA

MPC8260AZUMHBB Nrnd
NXP Semiconductors
MPC8260AZUPIBB MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP

MPC8260AZUPIBB - PowerPC G2 MPU 300MHz 480-TBGA | NXP

MPC8260AZUPIBB ⚠ 最后一次采购

规格对比

参数 MPC8260AZUMHBB MPC8260AZUPIBB
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $52.10 $180.00
Manufacturer NXP Semiconductors (formerly Freescale/Motorola) —
Product Family PowerQUICC II HIP4 (MPC82xx) —
Architecture RISC, PowerPC G2 —
数据总线宽度 64-Bit 64-bit (external memory bus)
Core Clock Frequency 266 MHz —
Number of Cores 1 1
Process Technology 0.25 µm CMOS 0.25 um HiP4
Supply Voltage (Core) 1.8 V 1.8 V
Supply Voltage (I/O) 3.3 V 3.3 V
Package Type 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch) —
Peripherals Communication Processor Module (CPM), PCI, Ethernet, ATM, HDLC —
工作温度 [DATA_NEEDED: industrial/commercial junction range] -40C to +105C (industrial)
RoHS 状态 [DATA_NEEDED: per NXP product page] [DATA_NEEDED: RoHS status not stated in web snippets]
安装类型 Surface Mount Surface Mount
Silicon Revision Rev B (HIP4) —
Tray Packaging Yes (per distributor listings) —
Family — PowerQUICC II
Core Processor — PowerPC G2
Bus Width — 32-bit
Core Speed — 300 MHz
Co-Processor / DSP — Communications; RISC CPM
RAM Controllers — DRAM, SDRAM
Graphics Acceleration — No
Display & Interface Controllers — None
封装 — 480-TBGA (37.5 x 37.5 mm, 1.55 mm height, 1.27 mm pitch)

数据手册与资源

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