MPC8306VMACDCA vs MPC8306SVMABDCA 对比
详细并排对比 MPC8306VMACDCA 出自 NXP Semiconductors 和 MPC8306SVMABDCA 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
MPC8306SVMABDCA ⚠ 最后一次采购规格对比
| 参数 | MPC8306VMACDCA | MPC8306SVMABDCA |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 最后采购期 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $11.56 | $17.00 |
| Core Architecture | PowerPC e300c3 (32-bit) | PowerPC e300c3 (Power Architecture) |
| Core Frequency | 200 MHz | 133 MHz |
| Instruction Set | Power Architecture, Book E | — |
| L1 Cache | 16 KB instruction / 16 KB data | — |
| Memory Controller | DDR1/DDR2 SDRAM, 16-bit data | DDR2 up to 333 MHz data rate |
| Ethernet | 2x 10/100 MAC (RGMII + MII/RMII) | Dual 10/100 MAC with MII/RMII |
| USB | USB 2.0 Full-Speed host/device | USB 2.0 Full-Speed |
| CAN | 2x CAN 2.0 | — |
| HDLC/TDM | 4 channels | — |
| PCI | 32-bit PCI 2.2 | — |
| Encryption | [DATA_NEEDED: SEC accelerator presence on this specific variant] | — |
| 封装 | 369-PBGA (19x19 mm, 1.0 mm pitch) | 369-MAPBGA (19x19 mm, 0.8 mm pitch) |
| 工作温度 | 0 C to +105 C | 0C to +105C |
| 安装类型 | Surface Mount (BGA) | — |
| RoHS 状态 | Compliant | Compliant (lead-free) |
| Core Count | — | 1 |
| 数据总线宽度 | — | 32-bit |
| On-chip Cache | — | 32 KB instruction / 32 KB data |
| Connectivity | — | QUICC Engine (HDLC, TDM), 2x UART |
| 电源电压 | — | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O |
| Lead-Free | — | Yes |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |