MPC8541ECPXALF vs MPC8555EVTAPF 对比

详细并排对比 MPC8541ECPXALF 出自 NXP Semiconductors 和 MPC8555EVTAPF 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8541ECPXALF MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP

MPC8541ECPXALF ✓ 量产中
NXP Semiconductors
MPC8555EVTAPF MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF - PowerQUICC III MPU, 833MHz e500, 783-FCPBGA | NXP

MPC8555EVTAPF ⚠ 最后一次采购

规格对比

参数 MPC8541ECPXALF MPC8555EVTAPF
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 最后采购期
Core Architecture PowerPC e500 (Book-E enhanced) PowerPC e500
Maximum Core Frequency 667 MHz —
数据总线宽度 64-bit 32 bit
Instruction Set 32-bit Power Architecture —
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
L2 Cache 256 KB 256 KB integrated
Core Supply Voltage 1.2 V (typical) —
I/O Supply Voltage 3.3 V —
Ethernet Controllers 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) —
Memory Controller DDR/DDR2 with ECC 32-bit DDR with ECC, up to DDR-333
PCI Express PCIe x1 / x2 —
Security Engine SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) IPSec / SSL / TLS / bulk crypto acceleration
封装 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) 783-FCPBGA (29 x 29 mm)
工作温度 -40C to +105C -40C to +105C (industrial extended)
安装类型 Surface Mount Surface Mount
RoHS Compliance Compliant (lead-free) —
Core Count — 1
最大时钟频率 — 833 MHz
Series — PowerQUICC III (MPC85xx)
L1 Cache — 32 KB instruction + 32 KB data
Ethernet — 4 x 10/100/1000 Mbps (SGMII/RGMII/TBI)
PCI Interface — 2 x PCI 2.2 (32-bit, 66 MHz)
电源电压 — 1.0 V core, 3.3 V I/O (typical)
RoHS 状态 — Compliant
MSL 等级 — [DATA_NEEDED: MSL rating]

数据手册与资源

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