MPC855TCZQ50D4 vs MPC860TVR50D4 对比
详细并排对比 MPC855TCZQ50D4 出自 NXP Semiconductors 和 MPC860TVR50D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC855TCZQ50D4 | MPC860TVR50D4 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | Obsolete |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $22.10 | $58.00 |
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) | — |
| Product Type | Microprocessor (MPU) | — |
| Processor Family | PowerQUICC MPC8xx / PowerPC | — |
| Core Architecture | 32-bit PowerPC with integrated CPM (Communications Processor Module) | PowerPC 32-bit |
| Core Clock Speed | 50 MHz | — |
| Number of Cores | 1 | — |
| 数据总线宽度 | 32-bit | — |
| 电源电压 | 3.3 V | — |
| 工作温度 | -40C to +95C | — |
| 封装 / 外壳 | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm | 357-PBGA (25x25 mm) |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| Integrated Peripherals | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI | — |
| On-chip Memory Controller | Yes (SDRAM, DRAM, SRAM, Flash support) | — |
| Packaging | Tray | — |
| Lead Free Status | Contains Lead | — |
| RoHS 状态 | Non-Compliant (legacy BGA contains lead) | [DATA_NEEDED: rohs compliance] |
| Process Technology | 0.32 um CMOS | 0.32 µm CMOS |
| Core Count | — | 1 |
| 最大时钟频率 | — | 50 MHz |
| Operating Supply Voltage (Core) | — | 3.3 V |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Instruction Cache | — | 4 Kbyte |
| Data Cache | — | 4 Kbyte |
| Integrated Communications Module (CPM) | — | Yes (SCC, SMC, SPI, I²C, UART) |
| PCMCIA Interface | — | Yes (Type I/II) |
| Memory Controller | — | DRAM, SRAM, EPROM, Flash |
| 工作温度范围 | — | -40°C to +95°C |
| Series | — | MPC8xx PowerQUICC |
| Lead-Free / Reflow Profile | — | [DATA_NEEDED: reflow profile] |