MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
料号： MPC855TCZQ50D4 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.75 | $2,975.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $22.1 | $22,100.00 |
MPC855TCZQ50D4 概述
A PowerQUICC device belongs to the Power Architecture (PowerPC) family of integrated microprocessors. It combines a CPU core, system memory controller, and a dedicated communications processor (CPM) for offloading networking and serial protocol work. The hierarchy is: microprocessor (MPU) -> PowerPC -> PowerQUICC -> communications SoC. PowerQUICC parts are typically deployed where deterministic networking performance is required without burdening the main CPU with protocol handling.
Key features of the MPC855TCZQ50D4 include the 50 MHz PowerPC core, an integrated CPM supporting Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, UART, and PCMCIA controllers, on-chip system memory controller, and a 357-ball PBGA footprint that is pin-compatible with the broader MPC860 family. The chip was originally branded Motorola, then transitioned to Freescale, and is now sold by NXP as the part matures through its end-of-life cycle. According to the manufacturer product page, the part is footprint-compatible with existing MPC860 PowerQUICC designs.
The architecture segregates general-purpose CPU work from real-time data-plane protocol processing. By offloading Ethernet, ATM, and HDLC packet handling to the CPM through dedicated RISC engines and DMA channels, the main PowerPC core stays free for control-plane tasks and application code. This dual-engine design is the defining architectural trait of the PowerQUICC family and the reason it became a long-standing platform for SOHO routers, DSLAM line cards, and industrial control routers.
Typical applications include SOHO / SMB routers and switches with Fast Ethernet WAN/LAN, DSL modem and ADSL/CPE gateway designs, industrial Ethernet and SCADA gateways, ATM edge devices, and legacy telecom equipment. The 100 Mbps Fast Ethernet support, combined with HDLC and ATM on the CPM, lets a single MPC855T replace several discrete protocol converters. The 3.3 V I/O and 50 MHz speed make it a fit for designs that prioritize protocol-rich I/O over raw CPU throughput.
When designing with this device, validate supply chain availability before committing to a new layout. Per the NXP product page, this part is reaching End of Life and replacements are listed in the official discontinuance notice - design teams should check the NXP PCN before board bring-up. The 357-BGA requires standard PBGA reflow profiles and X-ray inspection; signal integrity work is concentrated on the 60x bus and Ethernet MII traces.
This page synthesizes distributor pricing, BGA-compatible drop-in alternatives in the MPC8xx family, and design considerations beyond what is found in the bare manufacturer datasheet.
直接替换替代料： MPC855TCZQ50D4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC855TCZQ50D4 （相同外形与封装尺寸） ——差异在于 Core Architecture, Memory Controller, Operating Temperature, Process Technology, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
MPC855TVR50D4
✅ 直接替换✓ 有现货
$48.1 / 个
查看数据手册 →MPC860TVR50D4
✅ 直接替换✓ 有现货
$58 / 个
查看数据手册 →MPC860DEZQ50D4R2
✅ 直接替换📋 参考替代料（不在目录中）
MPC860TCZQ50D4
✅ 直接替换✓ 有现货
$16.8 / 个
查看数据手册 →MPC860ENZQ50D4
✅ 直接替换📋 参考替代料（不在目录中）
MPC855TCZQ50D4 最大额定值与电气特性
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | Microprocessor (MPU) |
| Processor Family | PowerQUICC MPC8xx / PowerPC |
| Core Architecture | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Clock Speed | 50 MHz |
| Number of Cores | 1 |
| 数据总线宽度 | 32-bit |
| 电源电压 | 3.3 V |
| 工作温度 | -40C to +95C |
| 封装 / 外壳 | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| 安装类型 | Surface Mount |
| Integrated Peripherals | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| On-chip Memory Controller | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS 状态 | Non-Compliant (legacy BGA contains lead) |
| Process Technology | 0.32 um CMOS |
MPC855TCZQ50D4 357-ball pbga (plastic ball grid array), 25x25 mm 引脚配置指南
MPC855TCZQ50D4（357-ball pbga (plastic ball grid array), 25x25 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC855TCZQ50D4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC855TCZQ50D4 适用于 6 应用s: SOHO / SMB Routers and Switches, DSL / ADSL Customer Premises Equipment (CPE), Industrial Ethernet and SCADA Gateways, ATM Edge and Access Multiplexers, Legacy Telecom Equipment Maintenance, Embedded Control and Building Automation.
SOHO / SMB Routers and Switches
The MPC855TCZQ50D4's integrated Fast Ethernet MAC, PowerPC core, and CPM at 50 MHz make it a natural fit for SOHO and SMB routers that need 100 Mbps WAN/LAN throughput. The dedicated CPM offloads NAT, packet filtering, and IP forwarding from the CPU, while the on-chip PCMCIA controller supports optional 802.11b/g cards for wireless gateways. The 357-BGA footprint matches MPC860 family parts, enabling product-family PCB reuse across multiple router SKUs without redesign.
推荐
DSL / ADSL Customer Premises Equipment (CPE)
The MPC855TCZQ50D4's combination of ATM support, Fast Ethernet, and HDLC channels aligns directly with legacy DSL CPE architectures. The CPM handles ATM AAL5 segmentation and reassembly while the PowerPC core runs the routing stack and PPPoE daemon. The -40C to +95C industrial operating range supports deployment in outdoor or basement CPE enclosures without active cooling. The 3.3 V supply and proven PowerQUICC ecosystem let OEMs reuse the Freescale MQX or Linux SDK without porting effort.
推荐
Industrial Ethernet and SCADA Gateways
Industrial Ethernet gateways benefit from the MPC855TCZQ50D4's HDLC, UART, and Fast Ethernet integration, which translate serial industrial protocols (Modbus RTU, Profibus) to Ethernet TCP/IP without an external protocol converter. The industrial -40C to +95C temperature range ensures operation in factory-floor cabinets and outdoor enclosures. The CPM's deterministic latency supports time-sensitive industrial protocols, while the PowerPC core runs the supervisory control application stack in the upper layers.
推荐
ATM Edge and Access Multiplexers
The MPC855TCZQ50D4 integrates ATM SAR and HDLC channels on the CPM that fit exactly the requirements of ATM edge multiplexers aggregating DSL or E1/T1 circuits. At 50 MHz the CPM handles the cell-rate pacing without CPU intervention, freeing the PowerPC core for OAM and management. The legacy 357-BGA footprint is shared with the MPC860 family, so multiplexer OEMs can scale product variants by simple BOM changes rather than PCB respins.
推荐
Legacy Telecom Equipment Maintenance
The MPC855TCZQ50D4 remains in service across the long tail of installed legacy telecom equipment that needs lifecycle extension. Per the Heisener distributor listing, the part continues to be stocked at 3,808+ pieces across authorized channels for aftermarket repair. The authorized Rochester Electronics cross-reference page on DigiKey confirms ongoing aftermarket availability for service-replacement needs. Design teams maintaining long-life telecom platforms can source this part for board-level repair without requalification.
推荐
Embedded Control and Building Automation
Building automation controllers benefit from the MPC855TCZQ50D4's I2C, SPI, PCMCIA, and serial channels, which directly connect to HVAC sensors, BACnet MS/TP transceivers, and Modbus field devices. The 50 MHz PowerPC core runs the building-management application, while the CPM offloads deterministic BACnet scheduling. The 357-BGA's industrial -40C to +95C rating supports unheated mechanical rooms, and the long-term availability through distribution channels suits the multi-decade service life expected of commercial buildings.
推荐
推荐产品汇总
工程参考数据： MPC855TCZQ50D4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC855TVR50D4 | MPC860TVR50D4 | MPC860DEZQ50D4R2 | MPC860TCZQ50D4 | MPC860ENZQ50D4 |
|---|---|---|---|---|---|---|
| Package | 357-Ball PBGA (25x25 mm) | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Processor Family | MPC855T (PowerQUICC) | MPC855T (PowerQUICC) | MPC860 (PowerQUICC) | MPC860 (PowerQUICC) | MPC860 (PowerQUICC) | MPC860EN (PowerQUICC) |
| Ethernet Channels | 1 (10/100 Mbps) | 1 (10/100 Mbps) | 2 (10/100 Mbps) | 2 (10/100 Mbps) | 2 (10/100 Mbps) | Enhanced Ethernet |
| Operating Temperature | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C |
| Packaging Format | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tray |
| RoHS Status | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | Active (mid-lifecycle) |
关键差异点
- Footprint-compatible with full MPC860 PowerQUICC family （对比 MPC860TVR50D4)
- Established PowerQUICC software ecosystem （对比 MPC8347E (PowerQUICC II))
- Cost-optimized Fast Ethernet access design （对比 MPC860ENZQ50D4)
设计说明
The 357-ball PBGA package has a relatively high junction-to-ambient thermal resistance for a BGA of this pin count. At full Fast Ethernet load the part typically dissipates 1.5-2.5 W depending on CPM utilization. Designers should place a continuous copper pour on the top and inner PCB layers beneath the BGA, plus thermal vias on a 1.2 mm pitch directly under the die shadow. For fan-less enclosures, follow the NXP PowerQUICC Hardware Specifications thermal layout guidelines - leaving the BGA without thermal vias can push Tj above 110C at 95C ambient.
The 357-BGA land pattern requires NSMD (non-solder-mask-defined) pads with a 0.6 mm ball pitch. Per the NXP PowerQUICC family hardware specifications, all BGA balls should connect to inner signal layers via short dogbone fan-outs or microvia-in-pad (if budget allows). Surface-mount the SDRAM and 50 MHz oscillator within 25 mm of the BGA to keep memory traces short - this is critical at 50 MHz to avoid over/undershoot. Place decoupling capacitors on the bottom side directly under the BGA via-in-pad positions for the core and PLL supply balls.
The 60x bus runs at the full 50 MHz core clock with DDR-style signal timing, so length-match data, address, and clock traces within +/-2 mm of the bus length, and add 33 ohm series termination at the MPC855T end of clock nets. The Ethernet MII traces to the PHY should be length-matched within 0.5 mm to preserve 100 Mbps timing margins - crosstalk increases rapidly when MII traces exceed 50 mm. Use a separate ground island under the MII region and stitch with a via fence every lambda/20.
The MPC855TCZQ50D4 is at End of Life per the NXP product page, so do not commit to it for new designs without a confirmed long-term supply agreement. For new designs, evaluate the MPC8347E (PowerQUICC II, e300 core) or MPC8323E (PowerQUICC III) - these use a different 488-pin PBGA and require a full PCB redesign. When substituting within the same footprint, verify the silicon revision because MPC860 variants differ in Ethernet channel count and CPM features - never assume feature parity from the family name alone.
合规信息
RoHS non-compliant per DigiKey product page (legacy BGA contains lead). REACH compliance assumed from NXP product family policy. AEC-Q100 not applicable (industrial/telecom MPU, not automotive grade). Not lead-free. Halogen-free status not specified in available data.
