MPC8572ECVTAVNE vs MPC8572VTAVNE 对比

详细并排对比 MPC8572ECVTAVNE 出自 NXP Semiconductors 和 MPC8572VTAVNE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC8572ECVTAVNE MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP

MPC8572ECVTAVNE Nrnd
NXP Semiconductors
MPC8572VTAVNE MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

MPC8572VTAVNE ✓ 量产中

规格对比

参数 MPC8572ECVTAVNE MPC8572VTAVNE
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $308.55 $308.00
Processor Type MPC85xx PowerQUICC III —
Core Architecture PowerPC e500, dual-core, 32-bit RISC PowerPC e500 (Book E, with SPE/APU)
Maximum CPU Clock 1.5 GHz —
Process Technology 0.09 um CMOS —
Core Voltage 1.1 V 1.1 V
I/O Voltage 1.8 V / 2.5 V / 3.3 V —
Number of Cores 2 2
L2 Cache [DATA_NEEDED: L2 cache size] 1 MB (shared)
Memory Controller DDR2/DDR3 with ECC (per datasheet family) DDR2 / DDR3 with ECC
Ethernet MACs 4x 10/100/1000 Mbit —
PCI Express 2x PCIe interfaces 3 x PCIe interfaces
Serial RapidIO 2x endpoints Yes
Security Engine SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G) Integrated
封装 1023-ball FCBGA (33x33 mm) 1023-ball FCBGA, 33 mm x 33 mm
安装类型 Surface Mount Surface Mount (BGA)
工作温度 [DATA_NEEDED: industrial temp grade] —
RoHS 状态 [DATA_NEEDED: confirm RoHS for this part suffix] compliant
Manufacturer — NXP Semiconductors (formerly Freescale)
Core Clock Frequency (max) — 1.5 GHz
工作温度范围 — 0 C to +105 C
Ethernet MAC — 2 x 10/100/1000 Mbps (Triple Speed)
MSL 等级 — [DATA_NEEDED: MSL classification]
Product Family — PowerQUICC III (MPC85xx)
Process Node — [DATA_NEEDED: fabrication process]

数据手册与资源

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