MPC8572ECVTAVNE - 1.5GHz Dual-Core PowerPC e500 SoC | NXP
料号： MPC8572ECVTAVNE ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $413.64 | $413.64 |
| 10 | $388.42 | $3,884.20 |
| 100 | $362.18 | $36,218.00 |
| 500 | $334.27 | $167,135.00 |
| 1,000 | $308.55 | $308,550.00 |
MPC8572ECVTAVNE 概述
What is a PowerQUICC III communications processor? A PowerQUICC III is a high-integration system-on-chip (SoC) that combines one or more PowerPC processor cores with specialized communications peripherals (Ethernet MACs, PCI Express, security engines). It sits in the broader taxonomy of embedded microprocessors -> MPU -> application processor -> SoC -> networking SoC, and is widely deployed in routers, switches, base stations, and storage platforms where deterministic packet processing is required.
Key features of the MPC8572E include dual e500 cores with MMU and double-precision FPU support, integrated DDR2/DDR3 memory controller with ECC, four 10/100/1000 Mbit Ethernet MACs, two PCI Express interfaces, dual Serial RapidIO endpoints, and an integrated security engine (SEC 4.0) for IPSec, SSL/TLS, and Kasumi/Snow 3G cipher acceleration. The device also exposes a Local Bus Controller, four I2C, four UART, and GPIO for legacy peripheral integration.
Architecturally the device pairs a hierarchical bus structure with the CoreNet platform coherency fabric, allowing the two cores and I/O engines to share memory and peripherals coherently while maintaining deterministic traffic shaping. The 1023-ball FCBGA delivers the high pin density required for the parallel memory and multiplexed I/O buses, and demands a multilayer PCB with controlled-impedance routing and a thermal solution rated for the device's typical power envelope.
Typical applications include enterprise routers, multi-service switches, LTE base-station baseband cards, IP-PBX platforms, network-attached storage controllers, and industrial gateways. The integrated security engine makes it well suited for VPN concentrators and SSL offload appliances, while the dual-core architecture supports control-plane plus data-plane partitioning.
A primary design consideration is thermal management: at 1.5 GHz with both cores active the device dissipates significant power, requiring thermal vias under the package and a heatsink in most production designs. Power sequencing of the 1.1 V core rail and the 1.8/2.5/3.3 V I/O rails must follow the datasheet order to avoid latch-up.
This page synthesizes distributor pricing, drop-in MPC8572 family alternatives, and practical board-design considerations not assembled in the NXP datasheet alone.
直接替换替代料： MPC8572ECVTAVNE ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC8572ECVTAVNE （相同外形与封装尺寸） ——差异在于 Memory Controller, Core Architecture, L2 Cache, Mounting Type, PCI Express.
快速对比工具——选择替代料号进行并排对比：
MPC8572ECVTAVNB
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572ECPXAULD
✅ 直接替换✓ 有现货
$219.8 / 个
查看数据手册 →MPC8572E
✅ 直接替换📋 参考替代料（不在目录中）
MPC8548EVJAUJD
✅ 直接替换📋 参考替代料（不在目录中）
MPC8572ECVTAVNE 最大额定值与电气特性
| Processor Type | MPC85xx PowerQUICC III |
| Core Architecture | PowerPC e500, dual-core, 32-bit RISC |
| Maximum CPU Clock | 1.5 GHz |
| Process Technology | 0.09 um CMOS |
| Core Voltage | 1.1 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V |
| Number of Cores | 2 |
| Memory Controller | DDR2/DDR3 with ECC (per datasheet family) |
| Ethernet MACs | 4x 10/100/1000 Mbit |
| PCI Express | 2x PCIe interfaces |
| Serial RapidIO | 2x endpoints |
| Security Engine | SEC 4.0 (IPSec/SSL/Kasumi/Snow 3G) |
| 封装 | 1023-ball FCBGA (33x33 mm) |
| 安装类型 | Surface Mount |
MPC8572ECVTAVNE 1023-ball fcbga (33x33 mm) 引脚配置指南
MPC8572ECVTAVNE（1023-ball fcbga (33x33 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC8572ECVTAVNE.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC8572ECVTAVNE 适用于 6 应用s: Enterprise Router / Switch Control Plane, LTE Base Station Baseband Card, IPSec / SSL VPN Concentrator, Network-Attached Storage (NAS) Controller, Industrial Gateway / Edge Router, VoIP / IP-PBX Media Gateway.
Enterprise Router / Switch Control Plane
The MPC8572ECVTAVNE's dual e500 cores at 1.5 GHz handle routing-table lookup, OSPF/BGP convergence, and management-plane tasks while the integrated four Gigabit Ethernet MACs aggregate line-card traffic. Its 1.1 V core plus 1.8/2.5/3.3 V I/O rails are typical of mid-range L3 switches, and the FCBGA-1023 package provides the pin density required for parallel DDR2/DDR3 plus four SerDes lanes.
推荐
LTE Base Station Baseband Card
For LTE eNodeB designs, the MPC8572ECVTAVNE's dual e500 cores can be partitioned one-per-sector or one-for-PHY/one-for-stack, while the SEC 4.0 engine accelerates Kasumi (UMTS) and Snow 3G (LTE) ciphering at line rate. The Serial RapidIO endpoints aggregate baseband data from RF cards, and PCI Express links to the digital front-end ASIC. At 1.5 GHz the device meets LTE 20 MHz channel processing budgets.
推荐
IPSec / SSL VPN Concentrator
The integrated SEC 4.0 crypto engine delivers multi-Gbps IPSec and SSL/TLS throughput for VPN concentrators, offloading AES-256/SHA-2 from the e500 cores. The four Gigabit Ethernet MACs feed encrypted traffic to uplink ports, and the dual-core architecture dedicates one core to crypto offload scheduling. FCBGA-1023 ensures the multi-lane SerDes and DDR bandwidth needed for line-rate security.
推荐
Network-Attached Storage (NAS) Controller
The MPC8572ECVTAVNE integrates a high-bandwidth memory subsystem plus dual PCI Express and Serial RapidIO links, making it a capable NAS/SAN controller SoC. The dual e500 cores handle file-system metadata and RAID parity calculation, while the Ethernet MACs expose iSCSI/NFS ports. DDR2/DDR3 ECC support protects data integrity across large memory footprints.
推荐
Industrial Gateway / Edge Router
For industrial Ethernet gateways the MPC8572ECVTAVNE's combination of legacy local-bus, UART, I2C, GPIO plus modern PCI Express and RapidIO enables bridging between factory-floor protocols and uplink Ethernet. The dual cores run a real-time OS plus management-plane networking stack, and the security engine protects operational-technology traffic crossing into IT networks.
推荐
VoIP / IP-PBX Media Gateway
Voice media gateways use the MPC8572ECVTAVNE to handle RTP packetization, jitter buffering, and codec processing on its dual e500 cores, while PCI Express links to DSP cards accelerate voice transcoding. The integrated security engine secures SIP/TLS and SRTP media streams. The 1.5 GHz clock provides ample MIPS for hundreds of concurrent VoIP channels per chassis.
推荐
推荐产品汇总
工程参考数据： MPC8572ECVTAVNE ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC8572ECVTAVNB | MPC8572ECPXAULD | MPC8572E | MPC8548EVJAUJD |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA - same family but verify ball map |
| Number of Cores | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 2 (dual e500) | 1 (single e500) |
| Security Engine (SEC 4.0) | Yes | Yes | Yes | Yes | Yes |
| PCI Express Interfaces | 2 | 2 | 2 | 2 | 1 (predecessor) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Obsolete / Legacy |
关键差异点
- Dual-core e500 in a 1023-FCBGA at 1.5 GHz with integrated security engine （对比 MPC8548EVJAUJD)
- Two PCI Express interfaces versus the single PCIe on the older MPC8548E （对比 MPC8548EVJAUJD)
- Same 1023-FCBGA package across the family （对比 MPC8572ECVTAVNB / MPC8572ECPXAULD)
设计说明
At 1.5 GHz with both e500 cores active the MPC8572ECVTAVNE typically dissipates 15-25 W, demanding a copper spreader, thermal interface material, and forced airflow in most chassis designs. Place thermal vias directly under the FCBGA land pattern to drop theta-JC to the PCB inner planes. Estimate (not a datasheet figure): with a 25 W dissipation and theta-JA of ~10 C/W (heatsink plus 200 LFM airflow), junction temperature rises ~250 C above ambient - derate per NXP's thermal model for your specific enclosure.
The MPC8572ECVTAVNE requires four voltage rails (1.1 V core, 1.8 V, 2.5 V, 3.3 V I/O) plus DDR termination VTT. Sequence the rails per the datasheet - the 1.1 V core must reach stable regulation before the I/O rails or latch-up may occur. Use a multi-rail PMIC with enable sequencing (NXP MC34VR500 or similar) rather than discrete regulators for cleanest turn-on. Verify in-rush and load-step behavior with an oscilloscope on each rail at first power-up.
The 1023-ball FCBGA demands a multilayer PCB (typically 8-12 layers) with microvia or stacked-via technology to fan out from the 1.0 mm ball pitch. DDR2/DDR3 traces must be length-matched within the byte-lane tolerance stated in the datasheet, and PCI Express / Serial RapidIO lanes require 85 ohm differential impedance with intra-pair skew under 5 ps. Reference NXP's hardware-design guidelines for layer stack and via pattern.
The Ethernet SerDes, PCI Express, and Serial RapidIO links all run at multi-Gbps speeds and are highly sensitive to PCB crosstalk. Maintain at least 3W (3x dielectric thickness) spacing between high-speed differential pairs and adjacent signals, and use ground-guard vias between channels. Series AC-coupling capacitors must be placed symmetrically; for PCIe, the 100 nF caps must be on the TX side per the spec.
Do not assume the 'AVNE' suffix means a specific feature set across all MPC8572E lots - the suffix encodes speed grade, voltage screening, and temperature bin. Always re-validate firmware boot, SerDes link training, and DDR2/DDR3 margining when swapping even between seemingly identical suffix codes. Also verify JTAG boundary-scan before first board bring-up; the FCBGA's hidden solder joints cannot be inspected post-reflow without X-ray.
合规信息
RoHS and REACH compliance assumed from the 'NE' suffix convention and NXP/Freescale product family policy. Halogen-free status not stated in the verified web data and set to 'unknown'. AEC-Q100 not applicable - this is a networking/comms SoC, not an automotive-qualified part.