MPC860PCZQ50D4 vs MPC860ENCVR50D4 对比

详细并排对比 MPC860PCZQ50D4 出自 NXP Semiconductors 和 MPC860ENCVR50D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860PCZQ50D4 MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP

MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP

MPC860PCZQ50D4 ✗ 停产
NXP Semiconductors
MPC860ENCVR50D4 MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP

MPC860ENCVR50D4 Nrnd

规格对比

参数 MPC860PCZQ50D4 MPC860ENCVR50D4
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 不推荐新设计
库存状态 有库存 有库存
单价(USD) $58.10 $52.40
Processor Type MPC8xx PowerQUICC 32-Bit MPU MPU PowerQUICC MPC8xx
Core Architecture PowerPC 603 (32-bit, no FPU) 32-Bit PowerPC
Core Frequency 50 MHz —
Number of Cores 1 (CPU + CPM RISC engine) —
Operating Voltage - I/O 3.3 V —
Internal Core Voltage 2.2 V or 1.8 V (selection required) —
Process Technology 0.32 micron CMOS 0.32 um CMOS
Instruction Cache 4 Kbyte 4 KB
Data Cache 4 Kbyte 4 KB
MMU Yes (32-bit virtual addressing) —
On-chip Ethernet MAC 2x 10/100 Mbps (MII interface) —
封装 357-PBGA (25x25 mm) —
工作温度范围 -40C to +85C (industrial, 'PC' suffix) [DATA_NEEDED: operating temperature range]
Lead Status Contains Lead —
RoHS 状态 Non-Compliant (contains lead) RoHS Compliant
安装类型 Surface Mount (BGA) Surface Mount
生命周期状态 End of Life —
Core Count — 1
最大时钟频率 — 50 MHz
工作电源电压 — 3.3 V
封装 / 外壳 — 357-BBGA (PBGA, 25 x 25 mm)
On-chip Peripherals — CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC
Packaging — Tray
Lead Free Status — Lead Free
Series — MPC8xx PowerQUICC

数据手册与资源

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