MPC875VR66 vs MPC875ZT66 对比
详细并排对比 MPC875VR66 出自 NXP Semiconductors 和 MPC875ZT66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC875VR66 | MPC875ZT66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 停产 |
| Product Type | Microprocessor (MPU) | — |
| Series | PowerQUICC MPC8xx | — |
| Core Architecture | MPC8xx (PowerPC) - 32-bit | — |
| Core Clock Frequency | 66 MHz | — |
| Performance | 87 MIPS | — |
| Number of Cores | 1 | — |
| Process Technology | 0.18 µm CMOS | 0.18 µm |
| 电源电压 | 3.3 V | 3.3 V |
| 工作温度 | 0 °C to +95 °C | — |
| 封装 | 256-PBGA (23 x 23 mm) | — |
| Ball Pitch | 1.27 mm | — |
| 安装类型 | Surface Mount | — |
| Operating Mounting Type | Tray | — |
| Integrated Peripherals | CPM (Communications Processor Module), SCC, HDLC, UART, SPI | — |
| External Memory Interface | Yes - SDRAM / Flash / ROM (32-bit address bus) | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Processor Type | — | MPC8xx communications processor |
| Architecture | — | Power Architecture |
| Core Count | — | 1 core |
| Data Width | — | 32-bit |
| 最大时钟频率 | — | 66 MHz |
| 工作温度范围 | — | 0 °C to 95 °C |
| Package Type | — | 256-pin PBGA (23 mm x 23 mm) |
| Package Code | — | HBGA |
| Terminal Count | — | 256 |
| Package Shape | — | Square |
| Peak Reflow Temperature | — | 245 °C |
| Application Category | — | Networking and communications applications |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Halogen-Free Status | — | [DATA_NEEDED: halogen-free status] |
| Pinout | — | [DATA_NEEDED: complete numbered pinout] |