MPC875VR80 vs MPC875ZT80 对比
详细并排对比 MPC875VR80 出自 NXP Semiconductors 和 MPC875ZT80 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC875VR80 | MPC875ZT80 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | 最后采购期 |
| Processor Type | MPC8xx communications microprocessor | — |
| Core Architecture | 32-bit Power Architecture | — |
| Core Count | 1 core | 1 |
| 数据总线宽度 | 32 bit | 32-bit |
| 最大时钟频率 | 80 MHz | 80 MHz |
| 电源电压 | 3.3 V | 3.3 V (core/IO) |
| Process Technology | 0.18 µm | — |
| Package Type | 256-ball PBGA (23 x 23 mm) | — |
| Device Category | Microprocessor (MPU) | — |
| 工作温度 | 0°C to 95°C | — |
| Memory Management | Memory-management units included | — |
| Instruction Cache | [DATA_NEEDED: instruction cache size] | — |
| Data Cache | [DATA_NEEDED: data cache size] | — |
| External Memory Interface | [DATA_NEEDED: external memory interface configuration] | — |
| Maximum Operating Current | [DATA_NEEDED: maximum operating current] | — |
| Maximum Supply Voltage | [DATA_NEEDED: maximum supply voltage] | — |
| RoHS 状态 | unknown | [DATA_NEEDED: RoHS status] |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | not_applicable | — |
| 安装类型 | Surface-mount BGA | Surface Mount |
| Architecture | — | Power Architecture (MPC8xx / PowerQUICC) |
| 封装 | — | 256-PBGA (23x23 mm) |
| 工作温度范围 | — | 0 C to 95 C |
| Series | — | MPC8xx / PowerQUICC |
| On-chip Memory | — | [DATA_NEEDED: cache/RAM/ROM sizes] |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| Integrated Peripherals | — | CPM (communications processor module), SIU, timers, UARTs, HDLC, PCI |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Family Position | — | MPC8xx / PowerQUICC I |