MPC875ZT80 vs MPC875VR80 对比
详细并排对比 MPC875ZT80 出自 NXP Semiconductors 和 MPC875VR80 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC875ZT80 | MPC875VR80 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 最后采购期 | 不推荐新设计 |
| Architecture | Power Architecture (MPC8xx / PowerQUICC) | — |
| Core Count | 1 | 1 core |
| 数据总线宽度 | 32-bit | 32 bit |
| 最大时钟频率 | 80 MHz | 80 MHz |
| 封装 | 256-PBGA (23x23 mm) | — |
| 工作温度范围 | 0 C to 95 C | — |
| Series | MPC8xx / PowerQUICC | — |
| On-chip Memory | [DATA_NEEDED: cache/RAM/ROM sizes] | — |
| 电源电压 | 3.3 V (core/IO) | 3.3 V |
| 安装类型 | Surface Mount | Surface-mount BGA |
| MSL 等级 | [DATA_NEEDED: MSL rating] | — |
| RoHS 状态 | [DATA_NEEDED: RoHS status] | unknown |
| Integrated Peripherals | CPM (communications processor module), SIU, timers, UARTs, HDLC, PCI | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Family Position | MPC8xx / PowerQUICC I | — |
| Processor Type | — | MPC8xx communications microprocessor |
| Core Architecture | — | 32-bit Power Architecture |
| Process Technology | — | 0.18 µm |
| Package Type | — | 256-ball PBGA (23 x 23 mm) |
| Device Category | — | Microprocessor (MPU) |
| 工作温度 | — | 0°C to 95°C |
| Memory Management | — | Memory-management units included |
| Instruction Cache | — | [DATA_NEEDED: instruction cache size] |
| Data Cache | — | [DATA_NEEDED: data cache size] |
| External Memory Interface | — | [DATA_NEEDED: external memory interface configuration] |
| Maximum Operating Current | — | [DATA_NEEDED: maximum operating current] |
| Maximum Supply Voltage | — | [DATA_NEEDED: maximum supply voltage] |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |