MPC880ZP66 vs MPC885ZP66 对比
详细并排对比 MPC880ZP66 出自 NXP Semiconductors 和 MPC885ZP66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MPC880ZP66 | MPC885ZP66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | Obsolete | 有效 |
| Processor Type | MPC8xx PowerQUICC communications microprocessor | — |
| Architecture | Power Architecture | — |
| Core Count | 1 core | 1 |
| Data Width | 32 bit | — |
| 最大时钟频率 | 66 MHz | 66 MHz |
| 电源电压 | 3.3 V | — |
| 工作温度范围 | 0 C to 95 C | — |
| Package Type | 357-PBGA (25 x 25 mm) | — |
| Package Pin Count | 357 pins | — |
| 安装类型 | Surface mount | Surface Mount |
| Packaging | Tray | — |
| RoHS 状态 | RoHS | Non-Compliant (legacy part) |
| Lead-Free Status | Contains Lead | — |
| Output Current | [DATA_NEEDED: processor output current specification] | — |
| Internal Memory | [DATA_NEEDED: internal memory configuration] | — |
| External Memory Interface | [DATA_NEEDED: external memory interface details] | — |
| Communications Peripherals | [DATA_NEEDED: communications peripheral list] | — |
| Maximum Power Dissipation | [DATA_NEEDED: maximum power dissipation] | — |
| 热阻 | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| 电源电流 | [DATA_NEEDED: operating supply current] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | PowerQUICC MPC8xx |
| Core Architecture | — | Power Architecture |
| 数据总线宽度 | — | 32 bit |
| Instruction Cache | — | 4 KB |
| Data Cache | — | 4 KB |
| 封装 | — | 357-ball PBGA, 25 mm x 25 mm |
| 工作温度 | — | 0 C to +95 C (commercial) |
| I/O Supply Voltage | — | 3.3 V |
| Core Supply Voltage | — | 1.8 V |
| Integrated Peripherals | — | Dual 10/100 Ethernet MAC, USB, HDLC/ATM, PCI, I2C, SPI, UART |
| Memory Controller | — | SDRAM, DRAM, SRAM, Flash, ROM |