MT40A512M8RH-075E:B vs K4A4G085WG-BCWE 对比

详细并排对比 MT40A512M8RH-075E:B 出自 Micron Technology 和 K4A4G085WG-BCWE 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A512M8RH-075E:B MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B - DDR4 4Gb 2666 MT/s SDRAM | Micron

MT40A512M8RH-075E:B ✓ 量产中
Samsung Electronics
K4A4G085WG-BCWE K4A4G085WG-BCWE - 4Gb DDR4 3200Mbps SDRAM | Samsung

K4A4G085WG-BCWE - 4Gb DDR4 3200Mbps SDRAM | Samsung

K4A4G085WG-BCWE ✓ 量产中

规格对比

参数 MT40A512M8RH-075E:B K4A4G085WG-BCWE
品牌 Micron Technology Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.15 $2.68
存储器类型 DDR4 SDRAM DDR4 SDRAM (Volatile)
Density 4 Gbit —
存储组织 512M x 8 —
数据速率 2666 MT/s (DDR4-2666) 3200 Mbps/pin
Clock Frequency 1333 MHz (1.33 GHz) —
VDD Supply Voltage 1.2 V +/-60 mV —
VDDQ Supply Voltage 1.2 V +/-60 mV —
VPP Supply Voltage 2.5 V, -125 mV/+250 mV —
接口类型 Parallel —
I/O Structure 1.2V pseudo open-drain —
基准电压 On-die internal adjustable VREFDQ generation —
封装 78-FBGA (9 x 10.5 mm), TFBGA FBGA-78 (BCW)
安装类型 Surface Mount Surface Mount
工作温度 [DATA_NEEDED: operating temperature range (standard grade)] [DATA_NEEDED: operating temperature range]
Refresh Refresh max interval extension at extended TC temperature range (125C capable per family features) [DATA_NEEDED: refresh rate specification]
Speed Grade Suffix -075E —
RoHS 状态 [DATA_NEEDED: RoHS status] Compliant
Packaging Option Suffix :B (ball map B designation per Mouser listing) —
存储容量 — 4 Gb
Memory Organization — 512M x 8
Speed Class — DDR4-3200
Supply Voltage (VDD) — 1.2 V
Technology — D-die DDR4
接口 — Parallel (DDR4)
Burst Length — BL8
DLL Mode — DLL Enabled (per datasheet timing)
Packaging — Tray

数据手册与资源

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