MT40A512M8RH-083E vs H5AN4G8NBJR-PBC 对比

详细并排对比 MT40A512M8RH-083E 出自 Micron Technology 和 H5AN4G8NBJR-PBC 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT40A512M8RH-083E MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E - 4Gb DDR4 512Mx8 2400MHz | Micron

MT40A512M8RH-083E ✓ 量产中
SK hynix
H5AN4G8NBJR-PBC H5AN4G8NBJR-PBC - 4Gb DDR4 SDRAM 512Mx8 FBGA-78 | SK hynix

H5AN4G8NBJR-PBC - 4Gb DDR4 SDRAM 512Mx8 FBGA-78 | SK hynix

H5AN4G8NBJR-PBC ✓ 量产中

规格对比

参数 MT40A512M8RH-083E H5AN4G8NBJR-PBC
品牌 Micron Technology SK hynix
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $3.30 $2.20
存储器类型 DDR4 SDRAM DDR4 SDRAM
Density 4 Gbit —
存储组织 512M x 8 512M x 8
Industry Speed Grade DDR4-2400 —
Clock Rate 1.2 GHz —
Internal Banks 8 banks (2 groups of 4) —
Prefetch 8n-bit —
Refresh 64 ms, 8192-cycle refresh (to 95C) 8n prefetch, standard/auto refresh per DDR4 JEDEC
VDD / VDDQ 1.2 V +/-60 mV —
VPP 2.5 V, -125 mV/+250 mV —
I/O Structure 1.2 V pseudo open-drain —
VREFDQ On-die internal, adjustable generation —
工作温度 0C to +95C —
封装 78-ball FBGA (9 x 10.5 mm) 78-ball FBGA
FBGA Code D9TGG —
Marking Code D9TGG —
Data Strobe Preamble Programmable —
RoHS 状态 Compliant —
CAS 延迟 [DATA_NEEDED: CAS latency per speed bin table] —
Memory Density — 4 Gbit
接口类型 — Parallel, JEDEC DDR4
Supply Voltage VDD — 1.2 V
Supply Voltage VDDQ — 1.2 V
Speed Grade — PBC
Clock Frequency — [DATA_NEEDED: Clock Frequency]
CAS Latency (CL) — [DATA_NEEDED: CAS Latency]
安装类型 — Surface Mount
Normal Operating Case Temperature — 0C to 85C
Extended Temperature Range — up to 95C case (with increased refresh)
Lead Free — Yes
无卤 — Yes

数据手册与资源

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