MT41K64M16TW-107 AUT:J vs K4B4G1646E-BYK000 对比

详细并排对比 MT41K64M16TW-107 AUT:J 出自 Micron Technology 和 K4B4G1646E-BYK000 出自 Samsung Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT41K64M16TW-107 AUT:J MT41K64M16TW-107 AUT:J - 1Gbit DDR3L SDRAM 933MHz | Micron

MT41K64M16TW-107 AUT:J - 1Gbit DDR3L SDRAM 933MHz | Micron

MT41K64M16TW-107 AUT:J ✓ 量产中
Samsung Electronics
K4B4G1646E-BYK000 K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 - 4Gb DDR3L SDRAM 256Mx16 | Samsung

K4B4G1646E-BYK000 ✓ 量产中

规格对比

参数 MT41K64M16TW-107 AUT:J K4B4G1646E-BYK000
品牌 Micron Technology Samsung Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.85 $0.56
存储器类型 SDRAM - DDR3L DDR3L SDRAM
存储容量 1 Gbit 4 Gbit
存储组织 64M x 16 256M x 16
接口 Parallel Parallel
Clock Frequency 933 MHz 800 MHz
Access Time 20 ns 1.25 ns
电源电压 1.35 V (DDR3L), 1.5 V compatible —
封装 96-FBGA (8 x 14 mm) 96-FBGA (BYK)
安装类型 Surface Mount Surface Mount
Temperature Grade AUT (automotive) —
工作温度 [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
CAS 延迟 [DATA_NEEDED: CAS latency] —
Refresh Rate [DATA_NEEDED: refresh rate] —
数据速率 1866 MT/s (DDR3L-1866) —
Termination On-Die Termination (ODT) —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Packaging Tray (T/R per listing) —
Speed Grade — DDR3-1600 (1.25 ns clock cycle)
CAS Latency (CL) — [DATA_NEEDED: CAS latency - 1.25 ns CL grade indicates CL11 but not explicitly stated in provided data]
Supply Voltage (VDD) — 1.35 V (DDR3L), 1.5 V compatible (DDR3)
Number of Banks — [DATA_NEEDED: bank count]
Die Process — Samsung E-die
特性 — Auto precharge, asynchronous reset, ZQ calibration, dynamic on-chip termination, data mask

数据手册与资源

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