MT53B128M32D1DS-062 vs MT53B128M32D1NP-062 对比
详细并排对比 MT53B128M32D1DS-062 出自 Micron Technology 和 MT53B128M32D1NP-062 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT53B128M32D1DS-062 - 4Gbit LPDDR4 SDRAM 1.6GHz | Micron
MT53B128M32D1DS-062 ✓ 量产中Micron Technology
MT53B128M32D1NP-062 - 4Gbit LPDDR4 SDRAM 1.6GHz | Micron
MT53B128M32D1NP-062 ✓ 量产中规格对比
| 参数 | MT53B128M32D1DS-062 | MT53B128M32D1NP-062 |
|---|---|---|
| 品牌 | Micron Technology | Micron Technology |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $5.45 | $6.05 |
| 存储器类型 | SDRAM - Mobile LPDDR4 | Mobile LPDDR4 SDRAM |
| 存储容量 | 4 Gbit | — |
| 存储组织 | 128M x 32 | 128M x 32 |
| Clock Frequency | 1600 MHz | 1.6 GHz |
| 数据速率 | DDR-3200 (3200 MT/s class) | — |
| Core Supply Voltage (VDD) | 1.1 V | — |
| I/O Supply Voltage (VDDQ) | 1.1 V | — |
| 接口 | LPDDR4 (JEDEC low-power DDR) | JEDEC LPDDR4 |
| 封装 | 200-WFBGA (10 x 14.5 mm) | 200-WFBGA (10 x 14.5 mm) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature range for base suffix] | — |
| Speed Grade | -062 | -062 |
| Access Time | [DATA_NEEDED: tAA access time] | — |
| Refresh Scheme | [DATA_NEEDED: refresh scheme 1x/2x/4x] | — |
| RoHS 状态 | RoHS compliant (per JLCPCB listing) | [DATA_NEEDED: RoHS status] |
| Memory Format | Volatile DRAM | — |
| Package Case Size | 10 mm x 14.5 mm | — |
| Density | — | 4 Gbit |
| Supply Voltage (VDD) | — | 1.1 V |
| Operating Temperature (AUT:A variant) | — | -40C to +125C (TC) |
| Operating Temperature (AAT:A variant) | — | -40C to +105C (TC) |
| Automotive Qualification (AUT:A variant) | — | AEC-Q100 |
| Packaging | — | Tape & Reel (TR variants) |
| MSL 等级 | — | [DATA_NEEDED: moisture sensitivity level] |
| Data Rate Class | — | [DATA_NEEDED: MT/s data rate] |