MT53E128M32D2DS-046 vs MT53E256M32D2DS-046 对比

详细并排对比 MT53E128M32D2DS-046 出自 Micron Technology 和 MT53E256M32D2DS-046 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
MT53E128M32D2DS-046 MT53E128M32D2DS-046 - 4Gb LPDDR4 SDRAM 200-WFBGA | Micron

MT53E128M32D2DS-046 - 4Gb LPDDR4 SDRAM 200-WFBGA | Micron

MT53E128M32D2DS-046 Obsolete
Micron Technology
MT53E256M32D2DS-046 MT53E256M32D2DS-046 - 8Gb LPDDR4 SDRAM | Micron Technology

MT53E256M32D2DS-046 - 8Gb LPDDR4 SDRAM | Micron Technology

MT53E256M32D2DS-046 ✓ 量产中

规格对比

参数 MT53E128M32D2DS-046 MT53E256M32D2DS-046
品牌 Micron Technology Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 Obsolete 有效
库存状态 有库存 有库存
单价(USD) $0.00 $9.10
存储器类型 Mobile LPDDR4 SDRAM (LPDDR4/LPDDR4X unified) LPDDR4 SDRAM (Mobile DRAM)
Density 4 Gbit 8 Gbit
存储组织 128M x 32 256M x 32
数据总线宽度 32 bit —
数据速率 2.133 GHz (speed bin -046) [DATA_NEEDED: data rate]
Maximum Clock Rate 4166 MHz (per Arrow listing) —
Configuration DDP (Double-Die Package) —
封装 200-WFBGA (10 mm x 14.5 mm) 200-WFBGA (10 x 14.5 mm)
VDDQ (LPDDR4X mode) 0.6 V —
VDDQ (LPDDR4 mode) 1.10 V —
Operating Temperature (AAT grade) -40C to +105C —
Operating Temperature (AIT grade) -40C to +95C —
安装类型 Surface Mount Surface Mount
Packaging Dry pack, Tape and Reel —
ECCN (US) EAR99 —
HTS 8542.32.00.28 —
Automotive Qualification Yes (per Arrow listing for AAT:A) —
RoHS 状态 EU RoHS Compliant [DATA_NEEDED: RoHS status]
Part Status Obsolete (per Arrow listing) —
Clock Frequency — 2133 MHz
Core Supply Voltage (VDD) — 1.1 V
Interface Supply Voltage (VDDQ) — [DATA_NEEDED: VDDQ voltage]
Operating Temperature (IT grade) — [DATA_NEEDED: IT temperature range]
Speed Grade — -046
Product Generation — MT53E (LPDDR4/LPDDR4X unified die, supports 0.6V VDDQ LPDDR4X operation)
Automotive Qualification (AUT grade variant) — AEC-Q100 qualified (AUT:B variant)
Packaging (TR suffix) — Tape & Reel (TR) or Tray

数据手册与资源

浏览全部产品 创建 BOM 获取报价