MT62F3G32D8DV-023 vs H58G66CK8BX147N 对比
详细并排对比 MT62F3G32D8DV-023 出自 Micron Technology 和 H58G66CK8BX147N 出自 SK hynix。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MT62F3G32D8DV-023 | H58G66CK8BX147N |
|---|---|---|
| 品牌 | Micron Technology | SK hynix |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $55.70 | $34.60 |
| 存储器类型 | SDRAM - Mobile LPDDR5X | LPDDR5X SDRAM |
| 存储容量 | 96 Gbit (12 GB) | — |
| Memory Organization | 3G x 32 | — |
| 数据速率 | 4266 Mbps/pin (4.266 GHz) | — |
| 接口 | LVSTL | LPDDR5/LPDDR5X protocol |
| Memory Bus Width | 32 bit | — |
| 封装 | 315-LFBGA (12.4 mm x 15 mm) | 315-ball FBGA |
| Ball Count | 315 | — |
| 安装类型 | Surface Mount | Surface Mount |
| Operating Temperature (WT grade) | -25C to +85C | — |
| Supply Voltage Class | LPDDR5X low-voltage class (per Micron datasheet) | — |
| Speed Grade | -023 (4266 Mbps) | — |
| Product Family | MT62F3G32 (LPDDR5/5X mobile DRAM) | — |
| Temperature Grade Codes | WT (wide temp commercial), IT, AT, AIT (automotive/industrial) | — |
| RoHS 状态 | Compliant (per Micron product page) | [DATA_NEEDED: RoHS Status] |
| Grade Options | Commercial, Industrial, Automotive | — |
| Density | — | 64 Gbit (8 GB) |
| 存储组织 | — | x8 (single channel) |
| Maximum Data Rate | — | 8533 Mbps |
| Supply Voltage Domain | — | 0.5 V to 1.8 V |
| Core Voltage Class | — | 1.05 V (LPDDR5/LPDDR5X class) |
| Standard Compliance | — | JEDEC-compliant single-channel SDRAM (per SK hynix 315-ball FBGA specification) |
| Channel Configuration | — | Single channel (x8 or x16 capable family) |
| Power Management | — | Dynamic voltage and frequency scaling (DVFSC/DVFSQ) |
| Application Domain | — | Smartphone, AI edge, server-class mobile computing |
| 工作温度 | — | [DATA_NEEDED: Operating Temperature Range] |
| Refresh Scheme | — | LPDDR5 per-bank / all-bank refresh |